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相關主題
商品描述
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.
The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.
By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
商品描述(中文翻譯)
在半導體製造中，了解各種材料的行為和互動方式對於製造可靠且穩健的半導體封裝至關重要。《半導體封裝：材料互動與可靠性》提供了對半導體封裝中使用的材料的基本物理特性的理解。
該書專注於半導體製造中的一個重要步驟-封裝組裝和測試。它涵蓋了材料特性的基礎知識，並解釋了如何確定哪些行為對封裝性能至關重要。作者還討論了封裝材料的特性如何相互作用，並探討了如何最大程度地提高這些材料在封裝完整性和可靠性方面的性能。
通過將半導體封裝所需的不同元素聯繫在一起，這本易於閱讀的書展示了所有部分如何相互配合，為集成電路芯片提供持久的保護，同時為芯片與外部世界通信提供手段。
