Area Array Packaging Handbook: Manufacturing and Assembly
暫譯: 區域陣列封裝手冊：製造與組裝

AREA ARRAY PACKAGING AT THE CUTTING EDGE

The first book to bring BGA, CSP, and Flip Chip together--teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging.

Filled with hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook is an unbeatable resource for success in todays fast-paced world of HDI.

Look for these highlights inside:

*The hottest technologies in electronics packaging—BGA, CSP, and Flip Chip—all in one reference

*Details on MEMs technology

*Pros and cons of each technology in various applications

*Solutions for difficult packaging ramifications of HDI design concepts

*Detailed coverage of critical reliability and testing issues

*Help with design, materials, and manufacturing processes

*Problem-solving approaches to conception, construction, assembly, and applications

*World-class expert contributors

*400 illustrations

ADVANCES

APPLICATIONS

CONCEPTS

DESIGN

ECONOMICS

OPIMIZATION

EQUIPMENT

FUTURE TECHNOLOGY

MATERIALS

PROCESSES

PRODUCTIVITY

Contents            

     Forword
   Section 1: Packaging Concepts and Design
    Chapter 1: Introduction to Electronic Packaging
    Chapter 2: Electronics Industry Overview
    Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry
    Chapter 4: Area Array Packaging
    Chapter 5: Stacked/3D Packages
    Chapter 6: Compliant IC Packaging
    Chapter 7: Flip Chip Technology
    Chapter 8: Options in High-Density Part Cleaning
    Chapter 9: MEMS Packaging and Assembly Challenges
    Chapter 10: Ceramic Ball and Column Grid Array Overview
   Section 2: Materials
    Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills
    Chapter 12: Hermetic Packaging Systems: Adhesive and Getter
    Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes
    Chapter 14: Modern Solder and Solder Paste
    Chapter 15: Lead-Free Systems and Process Implications
    Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?
   Section 3: Equipment and Processes
    Chapter 17: Next-Generation Flip Chip Materials and Processes
    Chapter 18: Flip Chip Assembly and Underfilling
    Chapter 19: BGA and CSP Rework: What is Involved?
    Chapter 20: BGA Assembly Reliability
    Chapter 21: Die Attach and Rework
    Chapter 22: Liquid Encapsulation Equipment and Processes
    Chapter 23: Molding for Area Array Packages
    Chapter 24: Screen Printing and Stenciling
    Chapter 25: Criteria for Placement and Processing of Advanced Packages
    Chapter 26: Ovens in Electronics
    Chapter 27: Process Development, Control, and Organization
   Section 4: Economics and Productivity
    Chapter 28: Metrics: The Key to Productivity
    Chapter 29: Cost Estimating for Electronic Assembly
   Section 5: Future
    Chapter 30: The Future of Electronic Packaging
    Chapter 31: The Future of SMT Process Equipment
     Index