Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free
暫譯: 區域陣列封裝材料：膠粘劑、膏料與無鉛材料

This engineering reference covers the most important assembly processes in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Processes includes vital information necessary for the manufacture of cutting-edge electronics products.

Contents ：           

    PREFACE
   Chapter 1: Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills
   Chapter 2: Hermetic Packaging Systems: Adhesive and Getter
   Chapter 3: Area Array Solder Spheres, Pastes, and Fluxes
   Chapter 4: Modern Solder and Solder Paste
   Chapter 5: Lead-Free Systems and Process Implications
   Chapter 6: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?
    INDEX