MEMS/MOEM Packaging
Ken Gilleo
- 出版商: McGraw-Hill Education
- 出版日期: 2005-08-01
- 售價: $6,410
- 貴賓價: 9.5 折 $6,090
- 語言: 英文
- 頁數: 240
- 裝訂: Hardcover
- ISBN: 0071455566
- ISBN-13: 9780071455565
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商品描述
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Table of Contents
PREFACE
Chapter 1: Engineering Fundamentals of MEMS and MOEMS Electronic Packaging
1.1: The Package as the Vital Bridge
1.2: Packaging Challenges
1.3: Multiple Functions
1.4: Package Types
1.5: Reliability and Qualification
1.6: SummaryChapter 2: Principles, Materials, and Fabrication of MEMS and MOEMS Devices
2.1: Definitions and Classifications
2.2: Basic Principles
2.3: Sensing
2.4: MEMS Sensor Principles
2.5: Motion Actuation
2.6: MEMS "Engines"
2.7: CAD Structure Library; Building Blocks
2.8: MEMS Devices
2.9: Optical-MEMS; MOEMS
2.10: Intelligent MEMS
2.11: MEMS Applications
2.12: MOEMS Devices -- MEMS Plus Light
2.13: SummaryChapter 3: MEMS and MOEMS Packaging Challenges and Strategies
3.1: Product-Specific Character of MEMS Packaging
3.2: MEMS General Packaging Requirements
3.3: Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual
3.4: Cost versus Performance Tradeoffs
3.5: Emergence of Low-Cost Near-Hermetic Packaging
3.6: Manufacturing Process Comparisons
3.7: The Packaging MOEMS (Optical-MEMS) -- Additional Requirements
3.8: Packages for Materials Handling
3.9: NHP Beyond MEMSChapter 4: MEMS Packaging Processes
4.1: Release Step
4.2: Singulation: Sawing and Protection
4.3: Capping Approaches
4.4: Die Attach
4.5: Wire Bonding
4.6: Flip Chip Methods
4.7: Tape Automated Bonding (TAB)
4.8: Selective Underfill and Encapsulation
4.9: Lid Sealing
4.10: Antistiction Processes
4.11: In-Process Handling
4.12: Applying In-Package Additives
4.13: Equipment
4.14: Testing
4.15: Reliability
4.16: Selecting the Right MEMS/MOEMS Package and Materials
4.17: Conclusions and SummaryChapter 5: MEMS Packaging Materials
5.1: The Process Determines the Materials
5.2: Joining Materials
5.3: Assembly Issues and Material Solutions
5.4: In-Package Additives
5.5: ConclusionsChapter 6: From MEMS and MOEMS to Nano Technology
6.1: Definitions are Important
6.2: Combining Nano and MEMS
6.3: Packaging Nano
6.4: Summary, Conclusions and the FutureBibliography
Index
商品描述(中文翻譯)
描述
儘管MEMS技術發展迅速,但由於封裝技術的障礙和成本問題,MEMS的商業化進程受到了阻礙。在MEMS、MOEM和納米電子設備的工業化過程中,適當的封裝解決方案的開發對於保護、組裝和長期可靠運行至關重要。本書嚴謹地研究了用於MEMS和MOEN組裝的材料的特性,並從路由、電性能、熱管理和可靠性等方面對其進行評估。在此基礎上,本書進一步討論了高級封裝方法,例如:用於MEMS的模塑熱塑性封裝、晶片組裝RFID和晶片級堆疊封裝。
目錄
前言
第1章:MEMS和MOEMS電子封裝的工程基礎
第2章:MEMS和MOEMS設備的原理、材料和製造
第3章:MEMS和MOEMS封裝的挑戰和策略
第4章:MEMS封裝過程
第5章:MEMS封裝材料
第6章:從MEMS和MOEMS到納米技術
以上是書籍的描述和目錄。