MEMS/MOEM Packaging
暫譯: MEMS/MOEM 封裝

Description

While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. 

Table of Contents

PREFACE

Chapter 1: Engineering Fundamentals of MEMS and MOEMS Electronic Packaging
1.1: The Package as the Vital Bridge
1.2: Packaging Challenges
1.3: Multiple Functions
1.4: Package Types
1.5: Reliability and Qualification
1.6: Summary

Chapter 2: Principles, Materials, and Fabrication of MEMS and MOEMS Devices
2.1: Definitions and Classifications
2.2: Basic Principles
2.3: Sensing
2.4: MEMS Sensor Principles
2.5: Motion Actuation
2.6: MEMS "Engines"
2.7: CAD Structure Library; Building Blocks
2.8: MEMS Devices
2.9: Optical-MEMS; MOEMS
2.10: Intelligent MEMS
2.11: MEMS Applications
2.12: MOEMS Devices -- MEMS Plus Light
2.13: Summary

Chapter 3: MEMS and MOEMS Packaging Challenges and Strategies
3.1: Product-Specific Character of MEMS Packaging
3.2: MEMS General Packaging Requirements
3.3: Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual
3.4: Cost versus Performance Tradeoffs
3.5: Emergence of Low-Cost Near-Hermetic Packaging
3.6: Manufacturing Process Comparisons
3.7: The Packaging MOEMS (Optical-MEMS) -- Additional Requirements
3.8: Packages for Materials Handling
3.9: NHP Beyond MEMS

Chapter 4: MEMS Packaging Processes
4.1: Release Step
4.2: Singulation: Sawing and Protection
4.3: Capping Approaches
4.4: Die Attach
4.5: Wire Bonding
4.6: Flip Chip Methods
4.7: Tape Automated Bonding (TAB)
4.8: Selective Underfill and Encapsulation
4.9: Lid Sealing
4.10: Antistiction Processes
4.11: In-Process Handling
4.12: Applying In-Package Additives
4.13: Equipment
4.14: Testing
4.15: Reliability
4.16: Selecting the Right MEMS/MOEMS Package and Materials
4.17: Conclusions and Summary

Chapter 5: MEMS Packaging Materials
5.1: The Process Determines the Materials
5.2: Joining Materials
5.3: Assembly Issues and Material Solutions
5.4: In-Package Additives
5.5: Conclusions

Chapter 6: From MEMS and MOEMS to Nano Technology
6.1: Definitions are Important
6.2: Combining Nano and MEMS
6.3: Packaging Nano
6.4: Summary, Conclusions and the Future

Bibliography
Index