Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau, John H.

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
  • 出版商: Springer
  • 出版日期: 2024-05-24
  • 售價: $7,150
  • 貴賓價: 9.5 折 $6,793
  • 語言: 英文
  • 頁數: 501
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 9819721393
  • ISBN-13: 9789819721399

    • 海外代購書籍(需單獨結帳)

相關主題

商品描述

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.

The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

商品描述(中文翻譯)

本書專注於翻轉晶片、混合鍵合、扇入和扇出技術的設計、材料、過程、製造及可靠性。書中探討了原理與工程實踐，並更重視工程實踐。這是通過對多個主要主題進行深入研究來實現的，例如晶圓凸點、翻轉晶片組裝、填充材料與可靠性、晶片對晶圓、晶圓對晶圓、銅對銅混合鍵合、WLCSP、六面模塑WLCSP、FOWLP（如具有PID、ABF和超大型有機介面層的混合基板）、晶片間的通訊與異質整合封裝，以及板上光學、近封裝光學和共同封裝光學等。

本書對於電機工程、機械工程、材料科學、工業工程等領域的研究人員、工程師和研究生均有助益。

作者簡介

John H. Lau, Ph.D., P.E., from July 2019 to June 2021, was the CTO of Unimicron, Taoyuan, Taiwan, where he has been a Senior Special Project Assistant since July 2021. Prior to that, he was a Senior Scientist/MTS with the Hewlett-Packard Laboratory and Agilent, Palo Alto, CA, USA, for 20 years; the Director of the System Packaging Laboratory, Institute of Microelectronics, Singapore, for two years; a Visiting Professor with The Hong Kong University of Science and Technology, Hong Kong, for one year; a Specialist with the Industrial Technology Research Institute, Hsinchu, Taiwan, for five year; a senior technical advisor at ASM Pacific Technology in Hong Kong for five years. He earned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign. With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 530 peer-reviewed technical publications (385 are the principalinvestigator), invented more than 52 issued or pending US patents (31 are the principal inventor), and given more than 350 lectures/workshops/keynotes worldwide. He has authored or coauthored 23 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, chiplet design and heterogeneous integrated packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.

作者簡介(中文翻譯)

約翰·H·劉博士，P.E.，於2019年7月至2021年6月擔任台灣桃園的Unimicron首席技術官，自2021年7月起擔任高級專案助理。在此之前，他在美國加州帕洛阿爾托的惠普實驗室和安捷倫工作了20年，擔任高級科學家/MTS；在新加坡微電子研究所擔任系統封裝實驗室主任兩年；在香港科技大學擔任訪問教授一年；在台灣新竹的工業技術研究院擔任專家五年；並在香港的ASM Pacific Technology擔任高級技術顧問五年。他在伊利諾伊大學香檳分校獲得理論與應用力學的博士學位。擁有超過40年的研發和製造經驗，他已發表或共同發表超過530篇經過同行評審的技術出版物（其中385篇為主要研究者），發明了超過52項已授權或待授權的美國專利（其中31項為主要發明者），並在全球舉辦了超過350場講座/研討會/主題演講。他已發表或共同發表23本關於扇出晶圓級封裝、3D IC異質整合與封裝、3D整合的TSV、高級MEMS封裝、chiplet設計與異質整合封裝、2D和3D IC互連的可靠性、翻轉晶片、WLP、MCM、區域陣列封裝、WLCSP、高密度PCB、SMT、DCA、TAB、無鉛材料、焊接、製造及焊點可靠性等方面的教科書。

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