Semiconductor Manufacturing Handbook, 2/e (Hardcover)
暫譯: 半導體製造手冊,第2版(精裝本)

Hwaiyu Geng

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商品描述

Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information

Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities.

•Nanotechnology and microsystems manufacturing

•FinFET and nanoscale silicide formation

•Physical design for high-performance, low-power 3D circuits

•Epitaxi, anneals, RTP, and oxidation

•Microlithography, etching, and ion implantations

•Physical, chemical, electrochemical, and atomic layer vapor deposition

•Chemical mechanical planarization 

•Atomic force  metrology

•Packaging, bonding, and interconnects

•Flexible hybrid electronics

•Flat-panel,flexible display electronics, and photovoltaics

•Gas distribution systems

•Ultrapure water and filtration

•Process chemicals handling and abatement

•Chemical and slurry handling systems

•Yield management, CIM, and factory automation

•Manufacturing execution systems 

•Advanced process control

•Airborne molecular contamination

•ESD controls in clean-room environments

•Vacuum systems and RF plasma systems

•IC manufacturing parts cleaning technology

•Vibration and noise design

•And much more

 

 

商品描述(中文翻譯)

徹底修訂的最先進半導體設計、製造與運營資訊

由70位國際專家撰寫,並經過資深技術顧問委員會審核,這本全面更新的資源清楚地解釋了在IC晶片、MEMS、感測器及其他電子設備的設計與製造中所使用的尖端流程。《半導體製造手冊》(Semiconductor Manufacturing Handbook)第二版涵蓋了使物聯網、工業物聯網、數據分析、人工智慧、擴增實境及智慧製造成為可能的新興技術。您將獲得有關半導體基礎知識、前端和後端流程、奈米技術、光伏技術、氣體和化學品、製造良率以及運營和設施的完整細節。

• 奈米技術與微系統製造

• FinFET與奈米級矽化物形成

• 高效能、低功耗3D電路的物理設計

• 外延、生長退火、快速熱處理(RTP)與氧化

• 微影技術、蝕刻與離子植入

• 物理、化學、電化學及原子層氣相沉積

• 化學機械平坦化

• 原子力計量

• 封裝、鍵合與互連

• 彈性混合電子產品

• 平面、柔性顯示電子產品及光伏技術

• 氣體分配系統

• 超純水與過濾

• 製程化學品處理與減排

• 化學品與漿料處理系統

• 良率管理、計算機整合製造(CIM)與工廠自動化

• 製造執行系統

• 先進製程控制

• 空氣中分子污染

• 潔淨室環境中的靜電放電(ESD)控制

• 真空系統與射頻等離子系統

• IC製造部件清潔技術

• 振動與噪音設計

• 以及更多內容