Assembly and Reliability of Lead-Free Solder Joints (美國原版)
暫譯: 無鉛焊點的組裝與可靠性

Lau, John H., Lee, Ning-Cheng

Assembly and Reliability of Lead-Free Solder Joints (美國原版)
  • 出版商: Springer
  • 出版日期: 2020-05-30
  • 售價: $6,600
  • 貴賓價: 9.5 折 $6,270
  • 語言: 英文
  • 頁數: 527
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 9811539197
  • ISBN-13: 9789811539190
  • 相關分類: Assembly

    • 海外代購書籍(需單獨結帳)

買這商品的人也買了...

商品描述

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

商品描述(中文翻譯)

本書專注於無鉛焊點的組裝與可靠性。內容涵蓋原理與工程實務，並更重視後者。這是通過對多個主要主題進行深入研究來實現的，例如傳統與先進封裝元件中的焊點、常用的無鉛材料、焊接過程、先進專用助焊劑設計、無鉛焊點的特性分析、可靠性測試與數據分析、可靠性設計，以及無鉛焊點的失效分析。獨特的是，內容不僅涉及第二級互連的電子製造服務（EMS），還包括第一級互連的封裝組裝以及3D IC整合互連的半導體後端。因此，本書為電子產品的完整供應鏈提供了不可或缺的資源。

作者簡介

John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 41/2 years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign.

With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.

He has received many awards from the American Society of Mechanical Engineers (ASME), the Institute of Electrical and Electronics Engineers (IEEE), the Society of Manufacturing Engineers (SME) and other societies. He is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME's, IEEE's, and IMAPS' technical activities.

 

Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development solder materials for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981.

Ning-Cheng has created numerous superior products. The electronics assembly materials, such as the industry benchmarks NC-SMQ92J and NC-SMQ230 solder pastes, have enabled the industry to achieve significantly higher yield and higher reliability. The most significant contributions are removing the art of SMT assembly and replacing it with science, for which he was bestowed SMTA Member of Distinction Award.

Ning-Cheng received 1991 award from SMT Magazine, 2008 and 2014 awards from IPC for Honorable Mention Paper - USA Award of APEX conference, and 2010 Best Paper Award of SMTA China South Conference. He was honored as 2002 Member of Distinction from SMTA, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, 2015 Founder's Award from SMTA, and 2017 IEEE Fellow. He has served on the board of governors for CPMT and SMTA board of directors. He served as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

作者簡介(中文翻譯)

約翰·H·劉（John H. Lau），博士，專業工程師，自2019年8月以來擔任台灣聯茂電子的首席技術官。在此之前，他在香港的ASM Pacific Technology擔任高級技術顧問5年；在台灣的工業技術研究院擔任專家4年半；以及在加州的惠普實驗室/安捷倫擔任高級科學家/主要技術專家超過25年。他在伊利諾伊大學香檳分校獲得理論與應用力學的博士學位。

擁有超過40年的研發和製造經驗，他已撰寫或共同撰寫超過480篇經過同行評審的技術出版物，發明了超過30項已授權或待授權的美國專利，並在全球進行了超過300場講座/研討會/主題演講。他已撰寫或共同撰寫20本教科書，內容涵蓋扇出晶圓級封裝、3D IC異質整合與封裝、3D整合的TSV、高級MEMS封裝、2D和3D IC互連的可靠性、翻轉晶片、WLP、MCM、區域陣列封裝、WLCSP、高密度PCB、SMT、DCA、TAB、無鉛材料、焊接、製造及焊點可靠性。

他曾獲得美國機械工程師學會（ASME）、電氣與電子工程師學會（IEEE）、製造工程師學會（SME）及其他學會的多項獎項。他是當選的ASME會士、IEEE會士及IMAPS會士，並積極參與ASME、IEEE及IMAPS的多項技術活動。

李寧誠（Ning-Cheng Lee）是Indium Corporation的技術副總裁，自1986年以來一直在Indium工作。在加入Indium之前，他曾在Morton Chemical和SCM工作。他在SMT行業的焊料材料開發方面擁有超過30年的經驗。此外，他在底填料和膠水的開發方面也有非常豐富的經驗。他於1981年在阿克倫大學獲得聚合物科學的博士學位。

李寧誠創造了許多優質產品。電子組裝材料，如行業基準NC-SMQ92J和NC-SMQ230焊膏，使行業能夠實現顯著更高的良率和更高的可靠性。他最重要的貢獻是將SMT組裝的藝術轉變為科學，因此獲得了SMTA卓越成員獎。

李寧誠於1991年獲得SMT雜誌獎，2008年和2014年獲得IPC的榮譽提名論文獎 - APEX會議的美國獎，並於2010年獲得SMTA中國南部會議的最佳論文獎。他於2002年被SMTA授予卓越成員，2007年獲得CPMT的傑出講者，2009年獲得SMTA的傑出作者，2015年獲得SMTA的創始人獎，並於2017年成為IEEE會士。他曾擔任CPMT的理事會成員及SMTA董事會成員，並擔任《焊接與表面貼裝技術》、《全球SMT與包裝》的編輯顧問委員會成員，以及IEEE《元件包裝製造技術期刊》的副編輯。他擁有眾多出版物，並經常在國際會議和研討會上就相關主題進行演講、受邀參加研討會、主題演講和短期課程。

類似商品

最後瀏覽商品 (15)