Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
暫譯: 避免集成電路裝置焊點互連中的非彈性應變
Suhir, Ephraim
- 出版商: CRC
- 出版日期: 2021-01-28
- 售價: $6,500
- 貴賓價: 9.5 折 $6,175
- 語言: 英文
- 頁數: 382
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 113862473X
- ISBN-13: 9781138624733
海外代購書籍(需單獨結帳)
商品描述
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
- Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices
- Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data
- Covers how to design the most effective test vehicles for testing solder joints
- Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections
- Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases
- Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests
This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
商品描述(中文翻譯)
避免IC裝置焊接接點中的非彈性應變一書，探討了旨在理解焊接材料及IC裝置焊接接點行為和性能的基本物理和力學的分析（數學）建模方法。重點在於可靠性設計，包括對焊接壽命的概率預測。
- 描述如何使用所開發的分析預測建模方法來最小化IC裝置焊接接點中的熱應力和應變
- 顯示如何通過比較有限元素分析（FEA）和分析數據來建立FEA的預處理模型
- 涵蓋如何設計最有效的測試工具來測試焊接接點
- 詳細說明如何設計和組織高聚焦且高成本效益的失效導向加速測試（FOAT），以理解焊接接點的失效物理，這有時可以替代或補充高度加速壽命測試（HALT）
- 概述如何將低週期疲勞條件轉換為彈性疲勞條件，並在這種情況下評估疲勞壽命
- 說明如何用更簡單且在物理上有意義的加速測試來取代耗時、費力、昂貴且可能誤導的溫度循環測試
本書旨在針對電子和光子封裝、電子和光學材料、材料工程以及機械設計的專業人士。
作者簡介
Ephraim Suhir is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE); the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE) and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored about 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including the 1996 Bell Labs Distinguished Member of Technical Staff Award and the 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering. He is the third Russian American, after Stephen Timoshenko and Igor Sikorsky, who received this prestigious award.
作者簡介(中文翻譯)
埃夫拉伊姆·蘇希爾是烏克蘭國家工程院的外國全職會員（院士）（他出生於該國）；電氣和電子工程師學會（IEEE）終身會員；美國機械工程師學會（ASME）、光學工程學會（SPIE）和國際微電子與封裝學會（IMAPS）終身會員；美國物理學會（APS）、英國物理學會（IoP）和塑料工程師學會（SPE）會員；以及美國航空航天學會（AIAA）副會員。埃夫拉伊姆已發表約400篇以上的出版物（專利、技術論文、書籍章節、書籍），在全球各地進行了多次主題演講和受邀演講，並獲得了許多專業獎項，包括1996年貝爾實驗室傑出技術人員獎和2004年ASME伍斯特·瑞德·華納獎，以表彰他對工程永久文獻的卓越貢獻。他是繼斯蒂芬·季莫申科和伊戈爾·西科爾斯基之後，第三位獲得這一榮譽獎項的俄裔美國人。
