Semiconductor Manufacturing Handbook 2e (Pb)
暫譯: 半導體製造手冊 第二版 (Pb)

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Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information

Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities.

-Nanotechnology and microsystems manufacturing

-FinFET and nanoscale silicide formation

-Physical design for high-performance, low-power 3D circuits

-Epitaxi, anneals, RTP, and oxidation

-Microlithography, etching, and ion implantations

-Physical, chemical, electrochemical, and atomic layer vapor deposition

-Chemical mechanical planarization

-Atomic force metrology

-Packaging, bonding, and interconnects

-Flexible hybrid electronics

-Flat-panel, flexible display electronics, and photovoltaics

-Gas distribution systems

-Ultrapure water and filtration

-Process chemicals handling and abatement

-Chemical and slurry handling systems

-Yield management, CIM, and factory automation

-Manufacturing execution systems

-Advanced process control

-Airborne molecular contamination

-ESD controls in clean-room environments

-Vacuum systems and RF plasma systems

-IC manufacturing parts cleaning technology

-Vibration and noise design

-And much more