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商品描述
Description
This Third Edition updates a landmark text with the latest findings
The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques.
Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including:
- Updated and revised figures and examples reflecting the most current data and information
- 260 new references offering access to the latest research and discussions in specialized topics
- New problems and review questions at the end of each chapter to test readers' understanding of the material
In addition, readers will find fully updated and revised sections in each chapter.
Plus, two new chapters have been added:
- Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy.
- Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge.
Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials.
Table of Contents
1. Resistivity.2. Carrier and Doping Density.
3. Contact Resistance and Schottky Barriers.
4. Series Resistance, Channel Length and Width, and Threshold Voltage.
5. Defects.
6. Oxide and Interface Trapped Charges, Oxide Integrity.
7. Carrier Lifetime.
8. Mobility.
9. Charge-Based and Probe Characterization.
10. Optical Characterization.
11. Chemical and Physical Characterization.
12. Reliability and Failure Analysis.
商品描述(中文翻譯)
**描述**
這第三版更新了一本具有里程碑意義的文本,包含最新的研究成果。
國際上廣受讚譽的《半導體材料與器件特性化》第三版將文本全面更新,以反映該領域的最新發展,並包含新的教學工具以協助讀者。第三版不僅列出了所有最新的測量技術,還探討了現有技術的新解釋和新應用。
《半導體材料與器件特性化》仍然是唯一一本專門針對測量半導體材料和器件的特性化技術的文本。內容涵蓋了全範圍的電氣和光學特性化方法,包括更專門的化學和物理技術。熟悉前兩版的讀者將會發現第三版經過徹底修訂和更新,包括:
- 更新和修訂的圖表和範例,反映最新的數據和資訊
- 260個新的參考文獻,提供最新研究和專題討論的訪問
- 每章結尾的新問題和回顧問題,以測試讀者對材料的理解
此外,讀者還會發現每章的內容均已全面更新和修訂。
另外,新增了兩章:
- 基於電荷和探針的特性化介紹了基於電荷的測量和凱爾文探針。本章還探討了基於探針的測量,包括掃描電容、掃描凱爾文力、掃描擴散電阻和彈道電子發射顯微鏡。
- 可靠性與失效分析探討了失效時間和分佈函數,並討論了電遷移、熱載流子、閘氧化物完整性、負偏壓溫度不穩定性、應力誘發漏電流和靜電放電。
由國際公認的該領域權威撰寫的《半導體材料與器件特性化》對於研究生以及在半導體器件和材料領域工作的專業人士來說,仍然是必讀的書籍。
**目錄**
1. 電阻率
2. 載流子和摻雜密度
3. 接觸電阻和肖特基障
4. 串聯電阻、通道長度和寬度、閾值電壓
5. 缺陷
6. 氧化物和界面捕獲電荷、氧化物完整性
7. 載流子壽命
8. 移動性
9. 基於電荷和探針的特性化
10. 光學特性化
11. 化學和物理特性化
12. 可靠性與失效分析