The Materials Science of Thin Films, 2/e
暫譯: 薄膜材料科學(第二版)

Milton Ohring

  • 出版商: Academic Press
  • 出版日期: 2001-10-15
  • 售價: $5,370
  • 貴賓價: 9.5$5,102
  • 語言: 英文
  • 頁數: 794
  • 裝訂: Hardcover
  • ISBN: 0125249756
  • ISBN-13: 9780125249751
  • 海外代購書籍(需單獨結帳)

商品描述

Description

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.

Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

 

Table of Contents

Foreword to First Edition
Preface
Acknowledgments
A Historical Perspective
Chapter 1 A Review of Materials Science
1.1. Introduction
1.2. Structure
1.3. Defects in Solids
1.4. Bonds and Bands in Materials
1.5. Thermodynamics of Materials
1.6. Kinetics
1.7. Nucleation
1.8. An Introduction to Mechanical Behavior
1.9. Conclusion
Exercises
References
Chapter 2 Vacuum Science and Technology
2.1. Introduction
2.2. Kinetic Theory of Gases
2.3. Gas Transport and Pumping
2.4. Vacuum Pumps
2.5. Vacuum Systems
2.6. Conclusion
Exercises
References
Chapter 3 Thin-Film Evaporation Processes
3.1. Introduction
3.2. The Physics and Chemistry of Evaporation
3.3. Film Thickness Uniformity and Purity
3.4. Evaporation Hardware
3.5. Evaporation Processes and Applications
3.6. Conclusion
Exercises
References
Chapter 4 Discharges, Plasmas, and Ion-Surface Interactions
4.1. Introduction
4.2. Plasmas, Discharges, and Arcs
4.3. Fundamentals of Plasma Physics
4.4. Reactions in Plasmas
4.5. Physics of Sputtering
4.6. Ion Bombardment Modification of Growing Films
4.7. Conclusion
Exercises
References
Chapter 5 Plasma and Ion Beam Processing of Thin Films
5.1. Introduction
5.2. DC, AC, and Reactive Sputtering Processes
5.3. Magnetron Sputtering
5.4. Plasma Etching
5.5. Hybrid and Modified PVD Processes
5.6. Conclusion
Exercises
References
Chapter 6 Chemical Vapor Deposition
6.1. Introduction
6.2. Reaction Types
6.3. Thermodynamics of CVD
6.4. Gas Transport
6.5. Film Growth Kinetics
6.6. Thermal CVD Processes
6.7. Plasma-Enhanced CVD Processes
6.8. Some CVD Materials Issues
6.9. Safety
6.10. Conclusion
Exercises
References
Chapter 7 Substrate Surfaces and Thin-Film Nucleation
7.1. Introduction
7.2. An Atomic View of Substrate Surfaces
7.3. Thermodynamic Aspects of Nucleation
7.4. Kinetic Processes in Nucleation and Growth
7.5. Experimental Studies of Nucleation and Growth
7.6. Conclusion
Exercises
References
Chapter 8 Epitaxy
8.1. Introduction
8.2. Manifestations of Epitaxy
8.3. Lattice Misfit and Defects in Epitaxial Films
8.4. Epitaxy of Compound Semiconductors
8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films
8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films
8.7. Mechanisms and Characterization of Epitaxial Film Growth
8.8. Conclusion
Exercises
References
Chapter 9 Film Structure
9.1. Introduction
9.2. Structural Morphology of Deposited Films and Coatings
9.3. Computational Simulations of Film Structure
9.4. Grain Growth, Texture, and Microstructure Control in Thin Films
9.5. Constrained Film Structures
9.6. Amorphous Thin Films
9.7. Conclusion
Exercises
References
Chapter 10 Characterization of Thin Films and Surfaces
10.1. Introduction
10.2. Film Thickness
10.3. Structural Characterization of Films and Surfaces
10.4. Chemical Characterization of Surfaces and Films
10.5. Conclusion
Exercises
References
Chapter 11 Interdiffusion, Reactions, and Transformations in Thin Films
11.1. Introduction
11.2. Fundamentals of Diffusion
11.3. Interdiffusion in Thin Metal Films
11.4. Compound Formation and Phase Transformations in Thin Films
11.5. Metal-Semiconductor Reactions
11.6. Mass Transport in Thin Films under Large Driving Forces
11.7. Conclusion
Exercises
References
Chapter 12 Mechanical Properties of Thin Films
12.1. Introduction
12.2. Mechanical Testing and Strength of Thin Films
12.3. Analysis of Internal Stress
12.4. Techniques for Measuring Internal Stress in Films
12.5. Internal Stresses in Thin Films and Their Causes
12.6. Mechanical Relaxation Effects in Stressed Films
12.7. Adhesion
12.8. Conclusion
Exercises
References
Index

商品描述(中文翻譯)

# 描述
這是第一本可以被視為薄膜科學的教科書,並在每章結尾附有練習題。Ohring為AP名單貢獻了許多備受推崇的參考書籍,包括《電子材料的可靠性與失效》和《薄膜的工程科學》。這本書的知識基礎旨在為高年級本科生或第一年研究生的薄膜課程提供學習資源,並為進入該領域或需要概覽的科學家和工程師提供參考。自1992年首次出版以來,薄膜領域已經大幅擴展,特別是在技術應用方面。第二版將使本書與這些進展保持同步。大多數章節已經大幅更新,並新增了幾個章節。

# 目錄
前言(第一版)
序言
致謝
歷史觀點
第一章 材料科學回顧
1.1. 介紹
1.2. 結構
1.3. 固體中的缺陷
1.4. 材料中的鍵結與能帶
1.5. 材料的熱力學
1.6. 動力學
1.7. 成核
1.8. 機械行為簡介
1.9. 結論
練習題
參考文獻
第二章 真空科學與技術
2.1. 介紹
2.2. 氣體的動力學理論
2.3. 氣體傳輸與抽真空
2.4. 真空泵
2.5. 真空系統
2.6. 結論
練習題
參考文獻
第三章 薄膜蒸發過程
3.1. 介紹
3.2. 蒸發的物理與化學
3.3. 薄膜厚度均勻性與純度
3.4. 蒸發硬體
3.5. 蒸發過程與應用
3.6. 結論
練習題
參考文獻
第四章 放電、等離子體與離子-表面相互作用
4.1. 介紹
4.2. 等離子體、放電與弧
4.3. 等離子體物理基礎
4.4. 等離子體中的反應
4.5. 溅射的物理
4.6. 離子轟擊對生長薄膜的改性
4.7. 結論
練習題
參考文獻
第五章 薄膜的等離子體與離子束處理
5.1. 介紹
5.2. 直流、交流與反應性溅射過程
5.3. 磁控溅射
5.4. 等離子體蝕刻
5.5. 混合與改良的物理氣相沉積過程
5.6. 結論
練習題
參考文獻
第六章 化學氣相沉積
6.1. 介紹
6.2. 反應類型
6.3. CVD的熱力學
6.4. 氣體傳輸
6.5. 薄膜生長動力學
6.6. 熱CVD過程
6.7. 等離子體增強CVD過程
6.8. 一些CVD材料問題
6.9. 安全
6.10. 結論
練習題
參考文獻
第七章 基板表面與薄膜成核
7.1. 介紹
7.2. 基板表面的原子視角
7.3. 成核的熱力學方面
7.4. 成核與生長中的動力學過程
7.5. 成核與生長的實驗研究
7.6. 結論
練習題
參考文獻
第八章 外延生長
8.1. 介紹
8.2. 外延的表現
8.3. 外延薄膜中的晶格失配與缺陷
8.4. 化合物半導體的外延
8.5. 外延半導體薄膜的高溫沉積方法
8.6. 外延半導體薄膜的低溫沉積方法
8.7. 外延薄膜生長的機制與表徵
8.8. 結論
練習題
參考文獻
第九章 薄膜結構
9.1. 介紹
9.2. 沉積薄膜與塗層的結構形態
9.3. 薄膜結構的計算模擬
9.4. 薄膜中的晶粒生長、取向與微觀結構控制
9.5. 受限薄膜結構
9.6. 非晶薄膜
9.7. 結論
練習題
參考文獻
第十章 薄膜與表面的表徵
10.1. 介紹
10.2. 薄膜厚度
10.3. 薄膜與表面的結構表徵
10.4. 表面與薄膜的化學表徵
10.5. 結論
練習題
參考文獻
第十一章 薄膜中的互擴散、反應與轉變
11.1. 介紹
11.2. 擴散的基本原理
11.3. 薄金屬膜中的互擴散
11.4. 薄膜中的化合物形成與相變化
11.5. 金屬-半導體反應
11.6. 在大驅動力下薄膜中的質量傳輸
11.7. 結論
練習題
參考文獻
第十二章 薄膜的機械性質
12.1. 介紹
12.2. 薄膜的機械測試與強度
12.3. 內部應力分析
12.4. 測量薄膜內部應力的技術
12.5. 薄膜中的內部應力及其成因
12.6. 受應力薄膜中的機械鬆弛效應
12.7. 附著力
12.8. 結論
練習題
參考文獻
索引