3D IC Integration and Packaging (Hardcover)
暫譯: 3D IC 整合與封裝 (精裝版)

John H. Lau

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商品描述

A comprehensive guide to 3D IC integration and packaging technology

 
3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.
 
3D IC Integration and Packaging covers:
 
• 3D integration for semiconductor IC packaging
• Through-silicon vias modeling and testing
• Stress sensors for thin-wafer handling and strength measurement
• Package substrate technologies
• Microbump fabrication, assembly, and reliability
• 3D Si integration
• 2.5D/3D IC integration
• 3D IC integration with passive interposer
• Thermal management of 2.5D/3D IC integration
• Embedded 3D hybrid integration
• 3D LED and IC integration
• 3D MEMS and IC integration
• 3D CMOS image sensors and IC integration
• PoP, chip-to-chip interconnects, and embedded fan-out WLP

商品描述(中文翻譯)

3D IC 整合與封裝技術的綜合指南

3D IC 整合與封裝 完整解釋了最新的微電子技術,旨在提高晶片密度、最大化性能並降低功耗。這本實用指南基於作者所開發的課程,提供現實世界的問題解決方法,並教授在系統層級決策中固有的權衡。探索關鍵的啟用技術,如 TSV、薄晶圓強度測量與處理、微焊球、重分佈層、介面層、晶圓對晶圓的鍵合、晶片對晶圓的鍵合、3D IC 與 MEMS、LED 以及互補金屬氧化物半導體影像感測器的整合。組裝、熱管理和可靠性將詳細介紹。

3D IC 整合與封裝 涵蓋:

• 3D 整合在半導體 IC 封裝中的應用

• 矽通孔的建模與測試

• 用於薄晶圓處理和強度測量的應力感測器

• 封裝基板技術

• 微焊球的製造、組裝與可靠性

• 3D 矽整合

• 2.5D/3D IC 整合

• 具有被動介面層的 3D IC 整合

• 2.5D/3D IC 整合的熱管理

• 嵌入式 3D 混合整合

• 3D LED 與 IC 整合

• 3D MEMS 與 IC 整合

• 3D CMOS 影像感測器與 IC 整合

• PoP、晶片對晶片互連及嵌入式扇出 WLP

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