3D IC Stacking Technology (Hardcover)
暫譯: 3D IC 疊層技術 (精裝版)

Banqiu Wu, Ajay Kumar , Sesh Ramaswami

3D IC Stacking Technology (Hardcover)
  • 出版商: McGraw-Hill Education
  • 出版日期: 2011-07-28
  • 售價: $2,500
  • 貴賓價: 9.8 折 $2,450
  • 語言: 英文
  • 頁數: 544
  • 裝訂: Hardcover
  • ISBN: 007174195X
  • ISBN-13: 9780071741958
  • 相關分類: 3D 列印、半導體

    • 立即出貨 (庫存=1)

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<內容簡介>

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical polishing for TSV applications
  • Temporary and permanent bonding
  • Assembly and test aspects of TSV technology

商品描述(中文翻譯)


<內容簡介>


三維集成電路堆疊技術的最新進展

本書3D IC Stacking Technology專注於工業應用，全面涵蓋三維設備集成的設計、測試和製造處理方法。本權威指南的每一章均由行業專家撰寫，詳細說明了各個製造步驟。未來的行業應用和尖端設計潛力也有討論。這是半導體工程師和便攜設備設計師的重要資源。


3D IC Stacking Technology涵蓋：



  • 高密度通過矽堆疊（TSS）技術

  • 異構3D IC產品的實用設計生態系統

  • 基於通過矽通孔（TSV）的3D IC堆疊的設計自動化和TCAD工具解決方案

  • TSV製造的工藝整合

  • TSV的高長寬比矽蝕刻

  • TSV的介電層沉積

  • 障礙層和種子層沉積

  • TSV的銅電鍍

  • TSV應用的化學機械拋光

  • 臨時和永久鍵合

  • TSV技術的組裝和測試方面

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