Semiconductor Advanced Packaging
暫譯: 半導體先進封裝

最近在半導體封裝方面的進展。- 系統封裝（System-in-Package）。- 內扇出晶圓/面板級晶片尺寸封裝（Fan-In Wafer/Panel-Level Chip-Scale Packages）。- 外扇出晶圓/面板級封裝（Fan-Out Wafer/Panel-Level Packaging）。- 2D、2.1D 和 2.3D IC 整合。- 2.5D IC 整合。- 3D IC 整合。- 混合鍵合（Hybrid Bonding）。- 晶片封裝（Chiplets Packaging）。- 介電材料（Dielectric Materials）。- 先進半導體封裝的趨勢與路線圖。

John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 41/2 years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign.With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.

He has received many awards from the American Society of Mechanical Engineers (ASME), the Institute of Electrical and Electronics Engineers (IEEE), the Society of Manufacturing Engineers (SME) and other societies. He is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME's, IEEE's, and IMAPS' technical activities.

約翰·H·劉（John H. Lau），博士，專業工程師，自2019年8月以來擔任台灣聯茂電子（Unimicron）的首席技術官。在此之前，他在香港的ASM Pacific Technology擔任高級技術顧問5年；在台灣的工業技術研究院擔任專家4年半；以及在加州的惠普實驗室/安捷倫（Hewlett-Packard Laboratory/Agilent）擔任高級科學家/主要技術專家超過25年。他在伊利諾伊大學香檳分校（University of Illinois at Urbana-Champaign）獲得理論與應用力學的博士學位。擁有超過40年的研發和製造經驗，他已發表或共同發表超過480篇經過同行評審的技術出版物，發明了超過30項已授權或待授權的美國專利，並在全球舉辦了超過300場講座/研討會/主題演講。他已撰寫或共同撰寫20本教科書，內容涵蓋扇出晶圓級封裝、3D IC異質整合與封裝、3D整合的通孔（TSV）、先進的MEMS封裝、2D和3D IC互連的可靠性、翻轉晶片（flip chip）、晶圓級封裝（WLP）、多晶片模組（MCM）、區域陣列封裝、晶圓級晶圓封裝（WLCSP）、高密度印刷電路板（PCB）、表面貼裝技術（SMT）、直接晶片附著（DCA）、膠帶附著（TAB）、無鉛材料、焊接、製造及焊點可靠性。

他曾獲得美國機械工程師學會（ASME）、電氣與電子工程師學會（IEEE）、製造工程師學會（SME）及其他學會的多項獎項。他是當選的ASME會士、IEEE會士及IMAPS會士，並積極參與ASME、IEEE及IMAPS的多項技術活動。