Testing of Interposer-Based 2.5D Integrated Circuits
暫譯: 基於介面層的2.5D集成電路測試

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.