相關主題
商品描述
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come.
This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book.
The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
商品描述(中文翻譯)
在「超越摩爾定律」的時代，尖端半導體設備的性能需求對半導體封裝中的極細間距互連提出了極高的要求。直接銅互連已成為半導體產業中細間距互連的首選技術，對於互連密度和設備性能具有顯著的好處。特別是低溫直接銅鍵合，未來幾年將廣泛應用於各種高性能半導體設備。
本書提供了對這一關鍵新技術的全面回顧和深入討論。第一章回顧了半導體封裝的演變及最新進展，導致對極細間距互連的需求；第二章回顧了不同的直接銅互連技術，並分析了各種應用的優缺點。第三章深入探討了混合鍵合技術，概述了關鍵過程和解決方案。第四章涵蓋了混合鍵合所需的材料，隨後幾章專注於銅電鍍（第五章）、平坦化（第六章）、晶圓鍵合（第七章）和晶片鍵合（第八章）的關鍵工藝步驟和設備。第九章涉及產品應用的設計，第十章則針對熱模擬。最後，第十一章涵蓋了可靠性考量和過程及性能特徵的計算機建模，隨後的第十二章概述了混合鍵合技術的當前和未來應用。各章中也涉及了計量和測試。與產品應用和技術製造部署相關的商業、經濟和供應鏈考量在書中相關章節中進行了討論，並概述了生態系統各方面的當前狀況和未來展望。
本書旨在為學術界和產業研究者以及業界實務者提供一個全面的最新知識來源，並回顧直接銅互連和先進半導體封裝技術及應用的最前沿狀態。
作者簡介
Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates, Inc., a provider of analog ASIC chips for thermal testing. He is also a Strategic Advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President for Technology & Engineering at Flex (formerly Flextronics), a global player for electronics design and manufacturing, and as Chief Marketing Officer at STATS ChipPAC (currently JCET), a leading provider of semiconductor assembly and test services. Early in his career, he held various technical and management responsibilities at Ford and Visteon on automotive electronics.
Dr. Shangguan has published several books and authored/co-authored over 200 technical papers, and has been issued 32 U.S. patents. He is an IEEE EPS Distinguished Lecturer, and has given numerous keynotes, seminars and lectures globally.
Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President's Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers.
Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. degree in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama, and has served as a guest professor at several universities.
Dr. Shangguan is based in San Jose, California, and travels globally in service of the industry.
作者簡介(中文翻譯)
董凱·商冠博士，IEEE Fellow 及 IMAPS Fellow，是熱工程協會公司的總裁，該公司提供用於熱測試的類比 ASIC 晶片。他同時也是全球半導體和電子產業創新公司的戰略顧問。此前，他曾擔任 Flex（前身為 Flextronics）的技術與工程企業副總裁，該公司是電子設計和製造的全球領導者，並擔任 STATS ChipPAC（目前為 JCET）的首席行銷官，該公司是半導體組裝和測試服務的領先提供商。在職業生涯早期，他在福特和 Visteon 擔任汽車電子領域的各種技術和管理職位。
商冠博士已出版多本書籍，並撰寫或共同撰寫超過 200 篇技術論文，並獲得 32 項美國專利。他是 IEEE EPS 的傑出講師，並在全球各地發表過多場主題演講、研討會和講座。
商冠博士曾擔任 iNEMI 董事會成員、IEEE EPS 理事會成員及 IPC 董事會成員。他因對行業的貢獻而獲得多項榮譽，包括 IEEE EPS 的電子製造技術獎和傑出持續技術貢獻獎、IMAPS 的威廉·D·阿什曼成就獎、IPC 的總統獎，以及製造工程師協會的電子製造卓越獎。
商冠博士在中國清華大學獲得機械工程學士學位，在聖荷西州立大學獲得 MBA 學位，並在英國牛津大學獲得材料學博士學位。他在劍橋大學和阿拉巴馬大學進行博士後教學和研究，並曾擔任多所大學的客座教授。
商冠博士目前居住在加州聖荷西，並在全球範圍內為行業服務。
