Antenna-In-Package Technology and Applications

Liu, Duixian, Zhang, Yueping

Antenna-In-Package Technology and Applications
  • 出版商: Wiley
  • 出版日期: 2020-03-31
  • 售價: $4,650
  • 貴賓價: 9.5 折 $4,418
  • 語言: 英文
  • 頁數: 416
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1119556635
  • ISBN-13: 9781119556633
  • 相關分類: 3D 列印、天線相關 Antennas、高普特考

    • 立即出貨 (庫存=1)

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商品描述

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging

Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors--well-known experts on the topic--explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP.

The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:

- Includes a brief history of antenna-in-package technology
- Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)
- Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance

Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

商品描述(中文翻譯)

《天線封裝技術與應用》是一本關於天線設計、製造過程、天線整合和封裝的全面指南。本書介紹了天線封裝技術的歷史，探討了天線和封裝、熱分析和設計，以及天線封裝技術的測量設置和方法。作者是該領域的知名專家，他們解釋了為什麼微帶貼片天線是最受歡迎的，並描述了封裝的諸多限制，如電性能、熱機械可靠性、緊湊性、可製造性和成本。本書還介紹了互連選擇如何受到JEDEC的自動組裝規範的影響，並描述了低溫共燒陶瓷、高密度互連、基於晶圓級封裝的AiP和基於3D打印的AiP。本書詳細討論了基於表面層電路的大規模毫米波相控陣列的AiP設計，包括94 GHz成像器和28 GHz 5G新無線電。此外，本書還介紹了用於感測器節點、近場無線電能傳輸和物聯網應用的3D AiP。本書的重點內容包括：- 簡要介紹天線封裝技術的歷史- 描述了在AiP中廣泛使用的封裝結構，如球網陣列（BGA）和無引線四方陣列（QFN）- 探討了概念、材料和過程、設計和驗證，特別考慮到優異的電性能、機械性能和熱性能。《天線封裝技術與應用》適合電氣工程學生、教授、研究人員和射頻工程師閱讀，提供了有關天線和封裝材料選擇、天線設計與製造過程和封裝限制、天線整合和封裝的指南。

作者簡介

DUIXIAN LIU, PHD, is a researcher and master inventorat IBM at Thomas J. Watson Research Center. He is a co-editor of the Wiley title Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits and Springer title Handbook of Antenna Technologies. He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation for nine years and a Guest Editor for the IEEE Transactions on Antennas and Propagation onfour Special Issues related to mm-wave antenna designs. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.

YUEPING ZHANG, PhD, is a Professor of Electronic Engineering at Nanyang Technological University and a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S). He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.

作者簡介(中文翻譯)

DUIXIAN LIU, PHD，是IBM Thomas J. Watson研究中心的研究員和主要發明家。他是Wiley出版社的《Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits》和Springer出版社的《Handbook of Antenna Technologies》的共同編輯。他曾擔任IEEE《Transactions on Antennas and Propagation》的副編輯長達九年，並擔任IEEE《Transactions on Antennas and Propagation》的客座編輯，負責四個與毫米波天線設計相關的特別議題。他於2012年獲得了享有盛譽的IEEE AP-S Sergei A. Schelkunoff Prize Paper Award。他是IEEE的會士。

YUEPING ZHANG, PhD，是南洋理工大學電子工程學系的教授，也是IEEE天線與傳播學會（IEEE AP-S）的傑出演講者。他曾擔任IEEE《Transactions on Antennas and Propagation》的副編輯。他於2012年獲得了享有盛譽的IEEE AP-S Sergei A. Schelkunoff Prize Paper Award。他是IEEE的會士。

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