Electronic Packaging Science and Technology (Hardcover)
暫譯: 電子封裝科學與技術 (精裝版)

Tu, King-Ning, Chen, Chih, Chen, Hung-Ming

Electronic Packaging Science and Technology (Hardcover)
  • 出版商: Wiley
  • 出版日期: 2021-12-29
  • 售價: $1,760
  • 貴賓價: 9.8 折 $1,725
  • 語言: 英文
  • 頁數: 336
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1119418313
  • ISBN-13: 9781119418313
  • 相關分類: 電子商務 E-commerce、電子學 Eletronics

    • 下單後立即進貨 (約5~7天)

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商品描述

Must-have reference on electronic packaging technology!

The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.

The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

 

商品描述(中文翻譯)

必備的電子封裝技術參考書！

隨著對於提高晶片電路密度的需求，而不增加生產成本，電子產業正朝向系統封裝技術轉型。電子封裝或電路整合被視為實現下一代電子產品中電子電路性能增長的必要策略。隨著新型材料的實施，這些材料具有特定且可調的電氣和磁性特性，電子封裝作為實現更高密度電路整合的解決方案，變得非常具有吸引力。

本書的第一部分概述了電子封裝，並為讀者提供了最重要的封裝技術的基本知識，如線焊接（wire bonding）、膠帶自動焊接（tap automatic bonding）、翻轉晶片焊接（flip chip solder joint bonding）、微凸焊接（microbump bonding）以及低溫直接銅對銅焊接（low temperature direct Cu-to-Cu bonding）。第二部分則包含電子電路設計的概念及其在低功耗設備、生物醫學設備和電路整合中的角色。書的最後一部分涵蓋了基於電子封裝科學和封裝技術可靠性的主題。

作者簡介

King-Ning Tu, PhD, is TSMC Chair Professor at the National Chiao Tung University in Taiwan. He received his doctorate in Applied Physics from Harvard University in 1968.

Chih Chen, PhD, is Chairman and Distinguished Professor in the Department of Materials Science and Engineering at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Materials Science from the University of California at Los Angeles in 1999.

Hung-Ming Chen, PhD, is Professor in the Institute of Electronics at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Computer Sciences from the University of Texas at Austin in 2003.

作者簡介(中文翻譯)

杜金寧博士是台灣國立交通大學的台積電講座教授。他於1968年在哈佛大學獲得應用物理學博士學位。

陳志博士是台灣國立陽明交通大學材料科學與工程系的系主任及特聘教授。他於1999年在加州大學洛杉磯分校獲得材料科學博士學位。

陳宏銘博士是台灣國立陽明交通大學電子研究所的教授。他於2003年在德克薩斯大學奧斯汀分校獲得計算機科學博士學位。

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