Electronic Packaging Science and Technology (Hardcover)

Tu, King-Ning, Chen, Chih, Chen, Hung-Ming

Electronic Packaging Science and Technology (Hardcover)
  • 出版商: Wiley
  • 出版日期: 2021-12-29
  • 售價: $1,760
  • 貴賓價: 9.8 折 $1,725
  • 語言: 英文
  • 頁數: 336
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1119418313
  • ISBN-13: 9781119418313
  • 相關分類: 電子商務 E-commerce、電子學 Eletronics

    • 立即出貨 (庫存=1)

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商品描述

Must-have reference on electronic packaging technology!

The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.

The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

 

商品描述(中文翻譯)

必備的電子封裝技術參考書！

由於需要在不增加生產成本的情況下實現更高的晶片電路密度，電子產業正轉向系統封裝技術。電子封裝，或稱電路集成，被視為實現下一代電子產品電路性能增長的必要策略。通過引入具有特定和可調電性和磁性的新型材料，電子封裝作為實現更高密度電路集成的解決方案非常有吸引力。

本書的第一部分概述了電子封裝並向讀者介紹了最重要的封裝技術基礎，如線鍵合、自動鍵合、翻轉芯片焊接、微凸點鍵合和低溫直接銅對銅鍵合。第二部分介紹了電子電路設計的概念及其在低功耗設備、生物醫學設備和電路集成中的作用。本書的最後一部分涵蓋了基於電子封裝科學和封裝技術可靠性的主題。

作者簡介

King-Ning Tu, PhD, is TSMC Chair Professor at the National Chiao Tung University in Taiwan. He received his doctorate in Applied Physics from Harvard University in 1968.

Chih Chen, PhD, is Chairman and Distinguished Professor in the Department of Materials Science and Engineering at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Materials Science from the University of California at Los Angeles in 1999.

Hung-Ming Chen, PhD, is Professor in the Institute of Electronics at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Computer Sciences from the University of Texas at Austin in 2003.

作者簡介(中文翻譯)

杜金寧博士是台灣國立交通大學的台積電講座教授。他於1968年從哈佛大學獲得應用物理學博士學位。

陳志博士是台灣國立陽明交通大學材料科學與工程系的主席和傑出教授。他於1999年從加州大學洛杉磯分校獲得材料科學博士學位。

陳宏明博士是台灣國立陽明交通大學電子研究所的教授。他於2003年從德克薩斯大學奧斯汀分校獲得計算機科學博士學位。

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