Electromigration in Metals: Fundamentals to Nano-Interconnects (Hardcover)
暫譯: 金屬中的電遷移：從基礎到奈米互連 (精裝版)
Paul S. Ho
- 出版商: Camberidge
- 出版日期: 2022-09-08
- 售價: $1,580
- 貴賓價: 9.8 折 $1,548
- 語言: 英文
- 頁數: 430
- ISBN: 1107032385
- ISBN-13: 9781107032385
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相關主題
商品描述
Book Description
Learn to assess electromigration reliability and design resilient chips, building from fundamental physics to advanced methodologies.
商品描述(中文翻譯)
書籍描述
學習評估電遷移可靠性並設計韌性晶片，從基本物理學到進階方法論。
