Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC(美國原版)
Er-Ping Li
- 出版商: IEEE
- 出版日期: 2012-04-10
- 售價: $4,060
- 貴賓價: 9.5 折 $3,857
- 語言: 英文
- 頁數: 384
- 裝訂: Hardcover
- ISBN: 0470623462
- ISBN-13: 9780470623466
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相關分類:
電子學 Eletronics、電磁學 Electromagnetics、電路學 Electric-circuits
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商品描述
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems
Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.
Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:
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The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems
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The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias
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Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations
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The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards
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An equivalent circuit model of through-silicon vias
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Metal-oxide-semiconductor capacitance effects of through-silicon vias
Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
商品描述(中文翻譯)
新的先進建模方法,用於模擬複雜的三維電子系統的電磁特性
根據作者的廣泛研究,本書提出了經過驗證和證明的電磁建模和模擬方法,用於分析大型複雜電子互連、多層封裝結構、集成電路和印刷電路板中的信號完整性、電源完整性和電磁干擾。讀者將了解電子封裝集成和印刷電路板模擬和建模技術的最新發展。除了常用的全波電磁計算方法外,本書還介紹了更先進的建模方法,為讀者提供分析和設計大型複雜電子結構的最先進工具。
《三維系統集成的電氣建模與設計》首先全面回顧了目前用於信號完整性、電源完整性和電磁兼容性的建模和模擬方法。接下來,本書引導讀者進行以下內容:
- 在三維集成系統中,用於電氣和電磁建模和模擬複雜互連的巨模建模技術
- 基於N體散射理論的半解析散射矩陣方法,用於建模具有多個通孔的三維電子封裝和多層印刷電路板
- 用於分析三維封裝集成中電源分佈網絡的二維和三維積分方程方法
- 基於物理的算法,用於提取三維集成系統和印刷電路板中複雜電源分佈網絡的等效電路
- 通過矽通孔的等效電路模型
- 矽通孔的金屬-氧化物-半導體電容效應
工程師、研究人員和學生可以參考本書,了解電子封裝、三維電子集成、集成電路和印刷電路板的電氣建模和設計的最新技術和方法。