Power Integrity Modeling and Design for Semiconductors and Systems (Hardcover)
暫譯: 半導體與系統的電源完整性建模與設計（精裝版）

Madhavan Swaminathan, Ege Engin

Power Integrity Modeling and Design for Semiconductors and Systems (Hardcover)
  • 出版商: Prentice Hall
  • 出版日期: 2007-11-01
  • 售價: $4,780
  • 貴賓價: 9.5 折 $4,541
  • 語言: 英文
  • 頁數: 496
  • 裝訂: Hardcover
  • ISBN: 0136152066
  • ISBN-13: 9780136152064
  • 相關分類: 半導體

    • 已絕版

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Description 

 

The First Comprehensive, Example-Rich Guide to Power Integrity Modeling

Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.

The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

The authors

  • Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
  • Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
  • Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
  • Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
  • Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures

This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

 

Table of Contents

Preface        xiii
Acknowledgments        xvii
About the Authors        xxi

Chapter 1: Basic Concepts        1

1.1    Introduction        1
1.2    Simple Relationships for Power Delivery        10
1.3    Design of PDNs        17
1.4    Components of a PDN        24
1.5    Analysis of PDNs        45
1.6    Chip-Package Antiresonance: An Example        61
1.7    High-Frequency Measurements        65
1.8    Signal Lines Referenced to Planes        71
1.9    PDN Modeling Methodology        77
1.10  Summary        79
 

Chapter 2: Modeling of Planes        83

2.1    Introduction        83
2.2    Behavior of Planes        84
2.3    Lumped Modeling Using Partial Inductances        89
2.4    Distributed Circuit-Based Approaches        94
2.5    Discretization-Based Plane Models        117
2.6    Analytical Methods        133
2.7    Multiple Plane Pairs        138
2.8    Summary        169
 

Chapter 3: Simultaneous Switching Noise        175

3.1    Introduction        175
3.2    Simple Models        177
3.3    Modeling of Transmission Lines and Planes        185
3.4    Application of Models in Time-Domain Analysis        209
3.5    Application of Models in Frequency-Domain Analysis        226
3.6    Extension of M-FDM to Incorporate Transmission Lines        233
3.7    Summary        239
 

Chapter 4: Time-Domain Simulation Methods        243

4.1    Introduction        243
4.2    Rational Function Method        244
4.3    Signal Flow Graphs        295
4.4    Modified Nodal Analysis (MNA)        317
4.5    Summary 327
 

Chapter 5: Applications 333

5.1    Introduction        333
5.2    High-Speed Servers        334
5.3    High-Speed Differential Signaling        349
5.4    Analysis of IC Packages        365
5.5    Extraction of Dielectric Constant and Loss Tangent        372
5.6    Embedded Decoupling Capacitors        392
5.7    Electromagnetic Bandgap (EBG) Structures        415
5.8    Future Challenges        443
 

Appendix A        451

A.1    Multiport Networks        451
A.2    Matrix Representation of Transmission Lines        453
A.3    Spectrum of Digital Signals        454
 

Appendix B: Software List        459

Index        461

商品描述(中文翻譯)

描述

第一本全面且充滿範例的電源完整性建模指南

專業人士如信號完整性工程師、封裝設計師和系統架構師需要徹底了解信號和電源完整性問題，以成功設計高速度系統的封裝和電路板。現在，首次推出一部完整的電源完整性建模指南：從基礎到最先進的技術，您需要了解的一切。

透過現實案例研究和可下載的軟體範例，兩位領先專家展示了當今設計和建模互連的最佳技術，以有效分配電源並最小化噪聲。

作者仔細介紹了電源分配設計的核心概念，系統地呈現並比較了建模噪聲的主要技術，並將這些技術與特定應用聯繫起來。他們的許多範例從最簡單的（使用解析方程計算電源噪聲）到複雜的系統級應用。

作者

- 介紹電源傳遞網路元件、分析、高頻測量和建模要求
- 徹底解釋電源/接地平面的建模，包括平面行為、集中建模、分佈電路基礎的方法等
- 提供

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