Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Yue Ma, Christian Gontrand
- 出版商: CRC
- 出版日期: 2019-03-28
- 售價: $4,980
- 貴賓價: 9.5 折 $4,731
- 語言: 英文
- 頁數: 248
- 裝訂: Hardcover
- ISBN: 0367023431
- ISBN-13: 9780367023430
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相關分類:
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商品描述
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
商品描述(中文翻譯)
隨著移動、可穿戴和物聯網(IoT)產品的出現，對芯片功能的需求和低功耗操作的要求不斷增加，因此3D/2.5D被視為不可避免的前進方向。隨著電路變得越來越複雜，特別是三維電路，必須在許多領域中開發新的見解，包括電氣、熱、噪音、互連和寄生效應。這些領域的交織開始成為我們進入3D納米電子的關鍵挑戰。本書旨在發展這種新的範式，從多個技術層面開始進行綜合。
