Wafer Bonding: Applications and Technology
Alexe, Marin, Gösele, Ulrich
- 出版商: Springer
- 出版日期: 2004-05-14
- 售價: $14,430
- 貴賓價: 9.5 折 $13,709
- 語言: 英文
- 頁數: 504
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 3540210490
- ISBN-13: 9783540210498
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相關分類:
半導體、電子學 Eletronics
海外代購書籍(需單獨結帳)
相關主題
商品描述
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
