Led Packaging Technologies: Design, Manufacture, and Applications
暫譯: LED封裝技術:設計、製造與應用

Annaniah, Luruthudass, Saheed, Mohamed Salleh M., Jose, Rajan

  • 出版商: Wiley-Vch
  • 出版日期: 2023-07-12
  • 售價: $5,090
  • 貴賓價: 9.5$4,836
  • 語言: 英文
  • 頁數: 176
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 3527348786
  • ISBN-13: 9783527348787
  • 海外代購書籍(需單獨結帳)

相關主題

商品描述

LED Packaging Technologies

Up-to-date practitioner's guide on LED packaging technologies, with application examples from relevant industries, historical insight, and outlook

LED Packaging Technologies provides expert insight into current and future trends in LED packaging technologies, discussing the fundamentals of LED packaging technologies, from electrical contact design, thermal management and optical emission, and extraction, to manufacturing technologies, including the JEDEC testing standards, followed by accounts on the main applications of these LED packages in the automotive, consumer electronics, and lighting industries.

LED Packaging Technologies includes information on:

  • History of primitive lighting in human civilization to the invention of modern LEDs based lighting, and historic evolution of LED packaging technology
  • Basic light emission and extraction technology in LED packages, covering package design impacting light emission and extraction
  • Medical industry applications of LEDs, especially in healthcare treatments, such as in skin rejuvenation and wound healing and closures
  • Quantum confinement phenomena and size-dependent optical properties of quantum dots, and the advancement of future quantum dot LEDs

Covering the fundamentals, design, and manufacturing of LED packaging technology and assisting in removing some of the barriers in the development of LED packaging and new applications, LED Packaging Technologies is an essential source of information for engineers in the LED and lighting industries, as well as researchers in academia.

商品描述(中文翻譯)

LED 封裝技術

最新的 LED 封裝技術實務指南,包含相關產業的應用範例、歷史洞察及未來展望

LED 封裝技術 提供了對當前及未來 LED 封裝技術趨勢的專家見解,討論 LED 封裝技術的基本原理,包括電接觸設計、熱管理、光發射及提取,還有製造技術,包括 JEDEC 測試標準,接著介紹這些 LED 封裝在汽車、消費電子及照明產業的主要應用。

LED 封裝技術 包含以下資訊:


  • 人類文明中原始照明的歷史到現代 LED 照明的發明,以及 LED 封裝技術的歷史演變
  • LED 封裝中的基本光發射及提取技術,涵蓋影響光發射及提取的封裝設計
  • LED 在醫療產業的應用,特別是在健康護理治療中,如皮膚再生及傷口癒合和閉合
  • 量子限制現象及量子點的尺寸依賴光學特性,以及未來量子點 LED 的進展

涵蓋 LED 封裝技術的基本原理、設計及製造,並協助消除 LED 封裝及新應用開發中的一些障礙,LED 封裝技術 是 LED 和照明產業工程師以及學術界研究人員的重要資訊來源。

作者簡介

Luruthudass Annaniah is the Director of Product Development at ams OSRAM Penang, Malaysia, and an Adjunct Lecturer of University Technology Petronas, Malaysia.

Mohamed Salleh M. Saheed works at Infineon Technologies (Kulim), Malaysia, as Technical Project Leader in Technology, Development and Innovation Department, specializing in Semiconductor Power Devices for automotive and industrial applications.

Rajan Jose is a senior Professor in the Universiti Malaysia Pahang (UMP), Malaysia, and is the Associate Editor-in-Chief of the Springer Nature journal Materials Circular Economy.

作者簡介(中文翻譯)

Luruthudass Annaniah 是馬來西亞檳城 ams OSRAM 的產品開發總監,同時也是馬來西亞石油科技大學的兼任講師。

Mohamed Salleh M. Saheed 在馬來西亞的英飛凌科技(Kulim)擔任技術專案負責人,隸屬於技術、開發與創新部門,專注於汽車和工業應用的半導體功率元件。

Rajan Jose 是馬來西亞彭亨大學(UMP)的資深教授,也是Springer Nature期刊《Materials Circular Economy》的副主編。