LED Packaging for Lighting Applications: Design, Manufacturing, and Testing (Hardcover)

<內容簡介>

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives.

<章節目錄>
Foreword (Magnus George Craford).
Foreword (C. P. Wong).
Foreword (B. J. Lee).
Preface.
Acknowledgments.
About the Authors.
Ch1: Introduction.
Ch2: Fundamentals and Development Trends of High Power LED Packaging.
Ch3: Optical Design of High Power LED Packaging Module.
Ch4: Thermal Management of High Power LED Packaging Module.
Ch5: Reliability Engineering of High Power LED Packaging.
Ch6: Design of LED Packaging Applications.
Ch7: LED Measurement and Standards.
Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance.
Index.