Resistive Random Access Memory (RRAM)
暫譯: 電阻式隨機存取記憶體 (RRAM)
Shimeng Yu
- 出版商: Morgan & Claypool
- 出版日期: 2016-03-18
- 售價: $1,460
- 貴賓價: 9.5 折 $1,387
- 語言: 英文
- 頁數: 80
- 裝訂: Paperback
- ISBN: 1627059296
- ISBN-13: 9781627059299
-
相關分類:
材料科學 Meterials、物理學 Physics、電子學 Eletronics
海外代購書籍(需單獨結帳)
買這商品的人也買了...
-
$650$585 -
$229精通 LabVIEW 信號處理
-
$230Altera FPGA/CPLD 設計 (基礎篇), 2/e
-
$221Python 樹莓派編程 (Learn Raspberry Pi Programming with Python)
-
$450$351 -
$301Intel FPGA/CPLD設計 基礎篇
商品描述
RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments and the electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAM's potential novel applications beyond the NVM applications.
商品描述(中文翻譯)
RRAM 技術在過去十年中取得了顯著進展,成為下一代非揮發性記憶體(NVM)的競爭候選者。本講座是關於金屬氧化物基 RRAM 技術的全面教程,涵蓋從裝置製造到陣列架構設計的各個方面。總結了最先進的 RRAM 裝置性能、特性分析和建模技術,並討論了 RRAM 整合到大型陣列及周邊電路的設計考量。第二章介紹了 RRAM 裝置的製造技術和消除形成過程的方法,並展示其可擴展性可達到小於 10 nm 的範圍。接著介紹了裝置性能,如編程速度、變異控制和多級操作,最後討論了可靠性問題,如循環耐久性和數據保持。第三章討論了 RRAM 的物理機制,以及觀察導電絲的材料特性分析技術和研究電子導電過程的電氣特性分析技術。還介紹了數值裝置建模技術,用於模擬導電絲的演變,以及用於電路級設計的緊湊裝置建模技術。第四章討論了兩種常見的 RRAM 陣列架構以實現大規模整合:一晶體管一電阻(1T1R)和帶選擇器的交叉點架構。介紹了寫入/讀取方案,並討論了周邊電路設計考量。最後,介紹了一種 3D 整合方法,用於構建超高密度的 RRAM 陣列。第五章是簡要總結,並展望 RRAM 在 NVM 應用之外的潛在新應用。