On-Chip Photonic Interconnects: A Computer Architect's Perspective (Synthesis Lectures on Computer Architecture)
Christopher J. Nitta, Matthew K. Farrens, Venkatesh Akella
- 出版商: Morgan & Claypool
- 出版日期: 2013-10-01
- 售價: $1,570
- 貴賓價: 9.5 折 $1,492
- 語言: 英文
- 頁數: 112
- 裝訂: Paperback
- ISBN: 1627052119
- ISBN-13: 9781627052115
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商品描述
As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection applications. Photonics, which has a fundamentally different mechanism of signal propagation, offers the potential to not only overcome the drawbacks of electrical signaling, but also enable the architect to build energy efficient, scalable systems. The purpose of this book is to introduce computer architects to the possibilities and challenges of working with photons and designing on-chip photonic interconnection networks.
Table of Contents: List of Figures / List of Tables / List of Acronyms / Acknowledgments / Introduction / Photonic Interconnect Basics / Link Construction / On-Chip Photonic Networks / Challenges / Other Developments / Summary and Conclusion / Bibliography / Authors' Biographies
商品描述(中文翻譯)
隨著晶片上核心數量的持續增加,架構師需要解決與互連網路相關的帶寬和功耗問題。由於能源效率的原因,電氣互連不太可能在大量處理器上良好擴展,而這個問題因為晶片的總功率預算是固定的而變得更加複雜,這個預算是由可以在不使用特殊(且昂貴)冷卻和包裝技術的情況下散發的熱量決定的。因此,需要尋找電信號在晶片內互連應用中的替代方案。光子學具有根本不同的信號傳播機制,不僅有潛力克服電信號的缺點,還能使架構師能夠構建能源效率高且可擴展的系統。本書的目的是向計算機架構師介紹使用光子和設計晶片內光子互連網路的可能性和挑戰。
目錄:圖表清單 / 表格清單 / 縮寫清單 / 致謝 / 介紹 / 光子互連基礎 / 連結建構 / 晶片內光子網路 / 挑戰 / 其他發展 / 總結與結論 / 參考文獻 / 作者簡介