Physical Design for 3D Integrated Circuits (Hardcover)

Aida Todri-Sanial, Chuan Seng Tan

Physical Design for 3D Integrated Circuits (Hardcover)

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商品描述

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

 

 

  • Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
  • Supplies state-of-the-art solutions for challenges unique to 3D circuit design
  • Features contributions from renowned experts in their respective fields

Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

商品描述(中文翻譯)

《三維積體電路的物理設計》揭示了如何有效且最佳地設計三維積體電路（IC）。同時，它還分析了利用三維技術的設計工具的優勢。

本書首先概述了傳統二維電路相關的物理設計挑戰，然後每一章節深入探討特定的物理設計主題。這本綜合性的參考書：

- 广泛涵蓋了2.5D/3D IC和單片3D IC的物理設計
- 提供了解決3D電路設計中獨特挑戰的最新解決方案
- 包含了各自領域的知名專家的貢獻

《三維積體電路的物理設計》為追求2.5D/3D技術的人提供了一個方便的、尖端的信息來源。

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