High-Speed Photonics Interconnects (Hardcover)
暫譯: 高速光子互連技術 (精裝版)
Lukas Chrostowski, Krzysztof Iniewski
- 出版商: CRC
- 出版日期: 2013-04-05
- 售價: $4,275
- 貴賓價: 9.5 折 $4,061
- 語言: 英文
- 頁數: 223
- 裝訂: Hardcover
- ISBN: 1466516038
- ISBN-13: 9781466516038
-
相關分類:
光電子學 Photonics
立即出貨 (庫存 < 4)
商品描述
Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects.
From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers
Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology.
Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips
This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
商品描述(中文翻譯)
處理能力的劇增迅速將片上總帶寬擴展到 Tb/s 的範圍。這需要相應增加晶片之間傳輸的數據量,以免限制整體系統性能。為了滿足對晶片間通信帶寬日益增長的需求,研究人員正在探索使用高速光互連架構。與其電氣對應物不同,光互連提供高帶寬和可忽略的頻率依賴損耗,使每通道數據速率超過 10 Gb/s 成為可能。《高速光子互連》探討了一些基於光子互連的突破性技術和應用。
從高速 I/O 電路的演變到最新的光子互連封裝和激光技術
本書匯集了來自學術界和業界專家的貢獻,將有關高速光子互連的各個方面的前沿研究集中在一個卷冊中。貢獻者深入探討了從高速輸入/輸出 (I/O) 電路的演變到光子互連封裝的最新趨勢等各種技術。本書討論了與 I/O 數據速率擴展和當前設計技術相關的挑戰。它還描述了主要的高速元件、通道特性和性能指標。本書讓讀者接觸到光子互連技術所啟用的各種應用。
了解適合與 CMOS 晶片進行高密度集成的光互連技術
這本插圖豐富的著作詳細說明了光晶片間通信鏈路如何充分利用通過互補金屬氧化物半導體 (CMOS) 技術擴展所提供的增強數據速率,並在合適的功率效率水平下運作。保持數學內容在最低限度,它為工程師、研究人員、研究生和企業家提供了高速光子互連動態格局的全面概述。