Copper Electrodeposition for Nanofabrication of Electronics Devices
暫譯: 銅電鍍在電子設備奈米製造中的應用

本書探討了銅電沉積的科學機制及其廣泛的應用範圍。書中將涵蓋從基本原理到實際應用的所有內容。此外，本書還將討論一些重要主題，例如：- 基於銅納米線的超大規模集成電路（ULSI）布線材料 - 印刷電路板 - 堆疊半導體 - 矽通孔（Through Silicon Via） - 用於鋰離子電池電極的光滑銅箔。本書非常適合納米技術專家、行業專業人士和實務工作者。

Kazuo Kondo is Professor at the Department of Chemical engineering, Osaka Prefecture University. He has over 200 research publications and 100 patents. His major areas of research are copper electrodeposition for nano fabrication, electrodeposition, batteries, and CVD.

Dale Barkey is a Professor of Chemical Engineering at the University of New Hampshire where he joined the faculty in 1987. His research in Electrochemical Engineering has addressed Pattern Formation, Electrodeposition, Anodizing and Corrosion Processes. His work has appeared in The Journal of the Electrochemical Society, Physical Review, The American Concrete Institute Materials Journal and Plating and Surface Finishing.

Rohan Akolkar is an Associate Professor of Chemical Engineering at Case Western Reserve University (CWRU) in Cleveland, OH. His research focuses on fundamental electrochemistry and electrochemical engineering. His work on electrodeposition has appeared in the Journal of the Electrochemical Society and the Journal of Power Sources. In 2004, he was received the Norman Hackerman Prize by the Electrochemical Society.

Masayuki Yokoi is the Chief Technical Consultant at the Industrial Technology Support Institute of Higashioska City, Osaka Prefecture, Japan.

Kazuo Kondo 是大阪府立大學化學工程系的教授。他擁有超過 200 篇研究出版物和 100 項專利。他的主要研究領域包括用於奈米製造的銅電鍍、電鍍、電池和化學氣相沉積（CVD）。

Dale Barkey 是新罕布什爾大學的化學工程教授，自 1987 年以來加入該校教職。他在電化學工程方面的研究涵蓋了圖案形成、電鍍、陽極氧化和腐蝕過程。他的研究成果發表在《電化學學會期刊》、《物理評論》、《美國混凝土學會材料期刊》和《電鍍與表面處理》上。

Rohan Akolkar 是克利夫蘭的凱斯西儲大學（CWRU）化學工程副教授。他的研究專注於基礎電化學和電化學工程。他在電鍍方面的研究成果發表在《電化學學會期刊》和《電源期刊》上。2004 年，他獲得了電化學學會頒發的 Norman Hackerman 獎。

Masayuki Yokoi 是日本大阪府東大阪市工業技術支援研究所的首席技術顧問。