Computer-Aided Design and VLSI Device Development (The Springer International Series in Engineering and Computer Science)
暫譯: 電腦輔助設計與VLSI裝置開發(施普林格國際工程與計算機科學系列)

Kit Man Cham, Soo-Young Oh, John L. Moll, Keunmyung Lee, Paul Vandevoorde

  • 出版商: Springer
  • 出版日期: 2011-11-10
  • 售價: $6,950
  • 貴賓價: 9.5$6,603
  • 語言: 英文
  • 頁數: 380
  • 裝訂: Paperback
  • ISBN: 1461289564
  • ISBN-13: 9781461289562
  • 相關分類: VLSIComputer-Science
  • 海外代購書籍(需單獨結帳)

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商品描述

examples are presented. These chapters are intended to introduce the reader to the programs. The program structure and models used will be described only briefly. Since these programs are in the public domain (with the exception of the parasitic simulation programs), the reader is referred to the manuals for more details. In this second edition, the process program SUPREM III has been added to Chapter 2. The device simulation program PISCES has replaced the program SIFCOD in Chapter 3. A three-dimensional parasitics simulator FCAP3 has been added to Chapter 4. It is clear that these programs or other programs with similar capabilities will be indispensible for VLSI/ULSI device developments. Part B of the book presents case studies, where the application of simu­ lation tools to solve VLSI device design problems is described in detail. The physics of the problems are illustrated with the aid of numerical simulations. Solutions to these problems are presented. Issues in state-of-the-art device development such as drain-induced barrier lowering, trench isolation, hot elec­ tron effects, device scaling and interconnect parasitics are discussed. In this second edition, two new chapters are added. Chapter 6 presents the methodol­ ogy and significance of benchmarking simulation programs, in this case the SUPREM III program. Chapter 13 describes a systematic approach to investi­ gate the sensitivity of device characteristics to process variations, as well as the trade-otIs between different device designs.

商品描述(中文翻譯)

範例將會被呈現。這些章節旨在向讀者介紹這些程式。程式的結構和所使用的模型將僅簡要描述。由於這些程式屬於公共領域(寄生模擬程式除外),讀者可參考手冊以獲取更多細節。在本第二版中,過程程式 SUPREM III 已被新增至第二章。裝置模擬程式 PISCES 取代了第三章中的程式 SIFCOD。三維寄生模擬器 FCAP3 已被新增至第四章。顯然,這些程式或其他具有類似功能的程式將對 VLSI/ULSI 裝置的開發不可或缺。本書的 B 部分呈現案例研究,詳細描述了模擬工具在解決 VLSI 裝置設計問題中的應用。問題的物理學透過數值模擬進行說明。這些問題的解決方案也被提出。討論了當前裝置開發中的問題,例如排水引起的障礙降低、溝槽隔離、熱電子效應、裝置縮放和互連寄生效應。在本第二版中,新增了兩個章節。第六章介紹了基準模擬程式的方法論和重要性,以 SUPREM III 程式為例。第十三章描述了一種系統化的方法來研究裝置特性對製程變異的敏感性,以及不同裝置設計之間的權衡。