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Defects in Microelectronic Materials and Devices (Hardcover)
暫譯: 微電子材料與器件中的缺陷 (精裝版)

Daniel M. Fleetwood, Ronald D. Schrimpf

  • 出版商: CRC
  • 出版日期: 2008-11-19
  • 售價: $8,430
  • 貴賓價: 9.5$8,009
  • 語言: 英文
  • 頁數: 770
  • 裝訂: Hardcover
  • ISBN: 1420043765
  • ISBN-13: 9781420043761
  • 海外代購書籍(需單獨結帳)

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商品描述

Uncover the Defects that Compromise Performance and Reliability
As microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.

A comprehensive survey of defects that occur in silicon-based metal-oxide semiconductor field-effect transistor (MOSFET) technologies, this book also discusses flaws in linear bipolar technologies, silicon carbide-based devices, and gallium arsenide materials and devices. These defects can profoundly affect the yield, performance, long-term reliability, and radiation response of microelectronic devices and integrated circuits (ICs). Organizing the material to build understanding of the problems and provide a quick reference for scientists, engineers and technologists, this text reviews yield- and performance-limiting defects and impurities in the device silicon layer, in the gate insulator, and/or at the critical Si/SiO2 interface. It then examines defects that impact production yield and long-term reliability, including:

  • Vacancies, interstitials, and impurities (especially hydrogen)
  • Negative bias temperature instabilities
  • Defects in ultrathin oxides (SiO2 and silicon oxynitride)

Take A Proactive Approach
The authors condense decades of experience and perspectives of noted experimentalists and theorists to characterize defect properties and their impact on microelectronic devices. They identify the defects, offering solutions to avoid them and methods to detect them. These include the use of 3-D imaging, as well as electrical, analytical, computational, spectroscopic, and state-of-the-art microscopic methods. This book is a valuable look at challenges to come from emerging materials, such as high-K gate dielectrics and high-mobility substrates being developed to replace Si02 as the preferred gate dielectric material, and high-mobility substrates.

商品描述(中文翻譯)

揭示妨礙性能和可靠性的缺陷
隨著微電子特徵和設備變得越來越小且複雜,工程師和技術人員必須完全了解在生產這些設備所需的日益複雜的製造過程中,元件可能會受到損壞的方式。

本書對基於矽的金屬氧化物半導體場效應晶體管(MOSFET)技術中發生的缺陷進行了全面調查,並討論了線性雙極技術、碳化矽設備以及砷化鎵材料和設備中的缺陷。這些缺陷可能會深刻影響微電子設備和集成電路(IC)的產量、性能、長期可靠性和輻射響應。本書組織材料以建立對問題的理解,並為科學家、工程師和技術人員提供快速參考,回顧了在設備矽層、閘極絕緣體和/或關鍵的Si/SiO2界面中的產量和性能限制缺陷及雜質。然後,它檢查了影響生產產量和長期可靠性的缺陷,包括:


  • 空位、間隙原子和雜質(特別是氫)

  • 負偏壓溫度不穩定性

  • 超薄氧化物(SiO2和矽氧氮化物)中的缺陷

採取主動的方法
作者濃縮了數十年的經驗和著名實驗者及理論家的觀點,以表徵缺陷特性及其對微電子設備的影響。他們識別這些缺陷,提供避免缺陷的解決方案和檢測方法,包括使用3D成像,以及電氣、分析、計算、光譜和最先進的顯微技術。本書對未來挑戰的寶貴見解來自新興材料,例如正在開發以取代SiO2作為首選閘極絕緣材料的高K閘極絕緣體和高遷移率基板。