Elements of Electromigration: Electromigration in 3D IC technology
Tu, King-Ning, Liu, Yingxia
- 出版商: CRC
- 出版日期: 2024-01-19
- 售價: $3,530
- 貴賓價: 9.5 折 $3,354
- 語言: 英文
- 頁數: 132
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 1032470275
- ISBN-13: 9781032470276
海外代購書籍(需單獨結帳)
相關主題
商品描述
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
商品描述(中文翻譯)
在這本對於研究生和實踐專業人士來說非常寶貴的資源中，Tu和Liu提供了對於電遷移的全面介紹，並提供了一個實用指南，教導如何管理其對於微電子設備的影響，尤其是那些使用3D架構的新型設備。
作者簡介
King-Ning Tu is Professor Emeritus at UCLA and Chair Professor of Materials and Electrical Engineering of City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1960, 1964, and 1968, respectively. Professor Tu is a world leader in the science of thin films, especially in their applications in microelectronic devices, packaging, and reliability.
Dr. Yingxia Liu is an Assistant Professor at City University of Hong Kong. Dr. Liu received her Ph.D. from the Department of Materials Science and Engineering, University of California, Los Angeles in 2016 and her Bachelor's degree from the College of Chemistry and Molecular Engineering, Peking University in 2012.
作者簡介(中文翻譯)
杜金寧教授是加州大學洛杉磯分校的名譽教授，也是香港城市大學材料與電機工程學系的講座教授。杜教授分別於1960年、1964年和1968年獲得國立臺灣大學學士學位、布朗大學碩士學位和哈佛大學應用物理學博士學位。杜教授在薄膜科學方面是世界領先者，尤其在微電子器件、封裝和可靠性應用方面有著卓越的成就。
劉英霞博士是香港城市大學的助理教授。劉博士於2016年獲得加州大學洛杉磯分校材料科學與工程系的博士學位，並於2012年獲得北京大學化學與分子工程學院的學士學位。
