Cold Plasma Materials Fabrication: Fundamentals To Applications
暫譯: 冷等離子體材料製造:基礎與應用
Alfred Grill
- 出版商: Wiley
- 出版日期: 1994-04-01
- 售價: $7,100
- 貴賓價: 9.5 折 $6,745
- 語言: 英文
- 頁數: 272
- 裝訂: Paperback
- ISBN: 0780347145
- ISBN-13: 9780780347144
已絕版
商品描述
Description:
Electrical Engineering/Circuits and Devices/Physics/Chemistry Cold Plasma in Materials Fabrication from Fundamentals to Applications Cold plasma research and development activities, as well as its applications in materials processing have grown enormously in the past decade. Cold Plasma in Materials Fabrication is a comprehensive, up-to-date monograph which presents all aspects of cold, low-pressure plasmas. The eight extensive chapters in this book cover the following topics:
- The main parameters and classifications of different types of plasma
- Reactions within cold plasmas and between cold plasmas and solid surfaces
- State-of-the-art methods for generation and diagnostics of cold plasmas and their application for processing of materials
This invaluable reference tool provides a helpful bibliography with suggestions for further reading on each subject. The book will be of importance to manufacturing engineers and scientists, as well as advanced students in engineering, materials, physics, and chemistry programs. Also of interest from IEEE Press Microelectronic System Interconnections Performance and Modeling Edited by Stuart K. Tewksbury, West Virginia University Written especially for those integrating forward-looking systems and system components, this anthology of seminal papers provides the facts needed to draw on or develop new interconnection technologies. 1994 Hardcover 528 pp IEEE Order No. PC0300-4 ISBN 0-7803-0405-5 Compound Semiconductor Transistors Physics and Technology Edited by Sandip Tiwari, IBM—T.J. Watson Research Center This handy resource offers a comprehensive look at the theoretical foundations that have been established for three of the most common forms of conventional compound semiconductor transistors: the metal-semiconductor field effect transistors (MESFETs), the heterostructure field effect transistors (HFETs), and the heterostructure bipolar transistors (HBTs). 1993 Hardcover 336 pp IEEE Order No. PC0313-7 ISBN 0-7803-0417-9 Surface Mount Technology Recent Japanese Developments Translated by TechSearch International, E. Jan Vardaman, President Available for the first time in English, these research results provide a valuable source to the most influential information on the topic of semiconductor packaging interconnect. 1993 Hardcover 336 pp IEEE Order No. PC0302-0 ISBN 0-7803-0407-1 Advances in Thermal Modeling of Electronic Components and Systems, Volume Three By Allan Kraus, Naval Post Graduate School, and Avram Bar-Cohen, University of Minnesota Co-published with ASME Press This practical book offers a cost-effective way for project man## consultants to gain a clear picture of the state of the art in the ## phenomena in electronic systems. 1993 Hardcover 416 pp IEEE Order No. PC03 ##
Table of Contents:
Preface.
List of Symbols.
Fundamentals of Plasma.
Cold Plasma Generation.
Plasma Chemistry.
Plasma Reactors.
Plasma Diagnostics.
Cold Plasma Processes for Surface Modification.
Deposition of Coatings by PECVD.
Plasma Assisted Etching.
Index.
About the Author.
商品描述(中文翻譯)
描述:
冷等離子體在材料製造中的應用從基礎到應用的研究與發展活動在過去十年中迅速增長。《冷等離子體在材料製造中的應用》是一本全面且最新的專著,介紹了冷等離子體和低壓等離子體的各個方面。本書的八個廣泛章節涵蓋以下主題:
- 不同類型等離子體的主要參數和分類
- 冷等離子體內部及其與固體表面之間的反應
- 冷等離子體的生成和診斷的最先進方法及其在材料加工中的應用
這本寶貴的參考工具提供了有用的參考書目,並對每個主題提供進一步閱讀的建議。本書對製造工程師和科學家,以及工程、材料、物理和化學專業的高級學生都具有重要意義。
此外,IEEE Press出版的《微電子系統互連性能與建模》由西維吉尼亞大學的Stuart K. Tewksbury編輯,特別為那些整合前瞻性系統和系統組件的人士撰寫,這本重要論文集提供了開發或利用新互連技術所需的事實。1994年,精裝本,528頁,IEEE訂單號:PC0300-4,ISBN 0-7803-0405-5。
《化合物半導體晶體管的物理與技術》由IBM T.J. Watson研究中心的Sandip Tiwari編輯,這本實用資源全面介紹了三種最常見的傳統化合物半導體晶體管的理論基礎:金屬-半導體場效應晶體管(MESFETs)、異質結場效應晶體管(HFETs)和異質結雙極晶體管(HBTs)。1993年,精裝本,336頁,IEEE訂單號:PC0313-7,ISBN 0-7803-0417-9。
《表面貼裝技術:最近的日本發展》由TechSearch International的E. Jan Vardaman翻譯,這些研究結果首次以英文出版,提供了半導體封裝互連主題上最具影響力的信息的寶貴來源。1993年,精裝本,336頁,IEEE訂單號:PC0302-0,ISBN 0-7803-0407-1。
《電子元件與系統的熱建模進展,第三卷》由海軍研究生院的Allan Kraus和明尼蘇達大學的Avram Bar-Cohen合著,與ASME Press共同出版。這本實用書籍為項目管理顧問提供了一種成本效益高的方式,以清晰了解電子系統中現象的最新技術狀態。1993年,精裝本,416頁,IEEE訂單號:PC03。
目錄:
- 前言
- 符號列表
- 等離子體基礎
- 冷等離子體生成
- 等離子體化學
- 等離子體反應器
- 等離子體診斷
- 用於表面改性之冷等離子體過程
- 透過PECVD沉積塗層
- 等離子體輔助蝕刻
- 索引
- 關於作者