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Electrical Engineering/Circuits and Electron Devices Routing in the Third Dimension From VLSI to MCMs Naveed Sherwani, Siddharth Bhingarde, and Anand Panyam A volume in the IEEE Press Series on Microelectronic Systems Stuart K. Tewksbury, Series Editor The complex computer chips of tomorrow will consist of not just one or two but several layers of metal interconnect. This makes the interconnect within a chip or a multichip module a three-dimensional problem. This book addresses the algorithmic and cell design issues in chip and MCM routing, with an emphasis on techniques for eliminating routing area. Key features include:
- a wealth of algorithms
- over-the-cell (OTC) routing
- multi-layer VLSI/thin film MCM routing
- MCM routing
- how to reduce chip size
- coverage of fabrication-specific issues.
This book will be of interest to CAD engineers, fabrication engineers, layout engineers, or anyone involved in integrated circuit design. It is also appropriate for use as an advanced-level text on the subject. Books of Related Interest from IEEE Press Microelectronic System Interconnections: Performance and Modeling Edited by Stuart Tewksbury 1994 Hardcover 528 pp IEEE Order No.:PC3004 ISBN 0-7803-0405-5 BiCMOS Integrated Circuit Design with Analog, Digital, and Smart Power Applications Edited by M.I. Elmasry 1994 Hardcover 528 pp IEEE Order No.:PC3467 ISBN 0-7803-0430-6 Codesign: Computer-Aided Hardware/Software Engineering Edited by Jerzy Rozenblit and Klaus Buchenreider 1995 Hardcover 464 pp IEEE Order No.:PC4028 ISBN 0-7803-1049-7
Table of Contents:
Preface.
Acknowledgments.
Introduction.
Graphs and Basic Algorithms.
Channel Routing and Terminal Assignment.
Routing Models.
Basic Problems in Routing.
Routing Algorithms for the Two-Layer Process.
Routing Algorithms for the Three-Layer Process.
Routing Algorithms for the Advanced Three-Layered Process.
Routing Algorithms for Advanced VLSI and Thin-Film MCMs.
Routing Algorithms for General MCMs.
Bibliography.
Author Index.
Subject Index.
商品描述(中文翻譯)
**書籍描述：**
《電機工程/電路與電子設備的三維路由：從 VLSI 到 MCMs》
作者：Naveed Sherwani, Siddharth Bhingarde, 和 Anand Panyam
IEEE Press 微電子系統系列的一本書
系列編輯：Stuart K. Tewksbury
未來的複雜計算機晶片將不僅僅由一層或兩層金屬互連組成，而是由多層金屬互連構成。這使得晶片或多晶片模組內的互連成為一個三維問題。本書針對晶片和 MCM 路由中的算法和單元設計問題進行探討，重點在於消除路由區域的技術。主要特點包括：
- 豐富的算法
- 超越單元的路由 (over-the-cell, OTC)
- 多層 VLSI/薄膜 MCM 路由
- MCM 路由
- 如何減少晶片尺寸
- 涵蓋製造特定問題
本書將吸引 CAD 工程師、製造工程師、佈局工程師或任何參與集成電路設計的人士。它也適合作為該主題的進階教材。
**相關書籍推薦：**
《微電子系統互連：性能與建模》
編輯：Stuart Tewksbury
1994 年 硬皮書 528 頁
IEEE 訂單號：PC3004
ISBN 0-7803-0405-5
《BiCMOS 集成電路設計：模擬、數位及智能電源應用》
編輯：M.I. Elmasry
1994 年 硬皮書 528 頁
IEEE 訂單號：PC3467
ISBN 0-7803-0430-6
《共同設計：計算機輔助硬體/軟體工程》
編輯：Jerzy Rozenblit 和 Klaus Buchenreider
1995 年 硬皮書 464 頁
IEEE 訂單號：PC4028
ISBN 0-7803-1049-7
**目錄：**
前言
致謝
介紹
圖形與基本算法
通道路由與端點分配
路由模型
路由中的基本問題
兩層工藝的路由算法
三層工藝的路由算法
進階三層工藝的路由算法
進階 VLSI 和薄膜 MCM 的路由算法
一般 MCM 的路由算法
參考文獻
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