Introductory Semiconductor Device Physics for Chip Design and Manufacturing (Hardcover)
暫譯: 晶片設計與製造的半導體器件物理入門 (精裝版)

Robert W. Keyes, Mary Y. Lanzerotti

  • 出版商: Wiley
  • 出版日期: 2018-01-03
  • 售價: $4,610
  • 貴賓價: 9.5$4,380
  • 語言: 英文
  • 頁數: 848
  • 裝訂: Hardcover
  • ISBN: 047062454X
  • ISBN-13: 9780470624548
  • 相關分類: 半導體物理學 Physics
  • 海外代購書籍(需單獨結帳)

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商品描述

An introduction to the fundamentals of semiconductor physics and engineering

This book discusses fundamental semiconductor physics of devices and on-chip interconnections for physicists and links these concepts to engineering applications and case studies of computer chips. The book is organized in three parts. The first part deals with the representation of information and computation. The second part covers semiconductor device physics within the context of computation. The third part reviews chip design and semiconductor fabrication. The book includes relevant equations, with the aim of closing the gap in the existing literature with actual case studies and engineering applications. Examples are provided in each chapter to illustrate physical and electrical concepts through the use of high-performance silicon technologies.

Introductory Semiconductor Device Physics for Chip Design and Manufacturing:

  • Provides physical descriptions and illustrations with data visualizations to facilitate intuitive understanding of semiconductor physics, devices and on-chip interconnections
  • Blends theoretical physics treatment with engineering applications and real case studies for manufactured chips
  • Presents complementary-metal-oxide-semiconductor (CMOS) transistors in high-performance server microprocessors with static CMOS combinational digital circuit design examples
  • Offers a rich array of student problem sets, mid-term exams, and final exams with a glossary at the end of the book

M. Y. Lanzerotti, PhD, has over 15 years of engineering experience in designing integrated circuits for high-performance server chips and aerospace applications. Dr. Lanzerotti is Assistant Professor of Physics at Augsburg College and previously held positions as Associate Professor of Computer Engineering at Air Force Institute of Technology, Instructor at Harvard Summer School, Visiting Faculty Fellow at Pacific Lutheran University, Visiting Faculty Fellow at Sapienza University of Rome, and Research Staff Member at IBM Thomas J. Watson Research Center. This book is inspired from Dr. Lanzerotti’s course, “Introductory Semiconductor Device Physics for Chip Design and Manufacturing,” at Harvard Summer School. Dr. Lanzerotti holds physics degrees from Harvard College, the University of Cambridge, and Cornell University. Dr. Lanzerotti holds four U.S. patents, was awarded an IEEE Technical Innovation Award in 2007 and an IBM Outstanding Research Contribution Award in 1998, and was Editor-in-Chief of the IEEE Solid-State Circuits Society Magazine.

商品描述(中文翻譯)

半導體物理與工程基礎介紹

本書討論了設備和晶片內部互連的基本半導體物理,並將這些概念與計算機晶片的工程應用和案例研究聯繫起來。該書分為三個部分。第一部分處理信息和計算的表示。第二部分涵蓋了計算背景下的半導體設備物理。第三部分回顧了晶片設計和半導體製造。書中包含相關的方程式,旨在通過實際案例研究和工程應用來填補現有文獻的空白。每一章都提供示例,以通過高性能矽技術來說明物理和電氣概念。

晶片設計與製造的入門半導體設備物理


  • 提供物理描述和插圖,並使用數據可視化來促進對半導體物理、設備和晶片內部互連的直觀理解

  • 將理論物理處理與工程應用和製造晶片的實際案例研究相結合

  • 展示高性能伺服器微處理器中的互補金屬氧化物半導體(CMOS)晶體管,並提供靜態CMOS組合數位電路設計示例

  • 提供豐富的學生問題集、中期考試和期末考試,並在書末附有詞彙表

M. Y. Lanzerotti博士擁有超過15年的工程經驗,專注於高性能伺服器晶片和航空航天應用的集成電路設計。Lanzerotti博士是奧斯堡學院的物理助理教授,曾擔任空軍技術學院的計算機工程副教授、哈佛夏季學校的講師、太平洋路德大學的訪問教員、羅馬薩賓納大學的訪問教員以及IBM托馬斯·J·沃森研究中心的研究人員。本書的靈感來自Lanzerotti博士在哈佛夏季學校教授的課程“晶片設計與製造的入門半導體設備物理”。Lanzerotti博士擁有哈佛大學、劍橋大學和康奈爾大學的物理學位。他擁有四項美國專利,於2007年獲得IEEE技術創新獎,1998年獲得IBM傑出研究貢獻獎,並曾擔任IEEE固態電路學會雜誌的主編。