Physical Design for 3D Integrated Circuits (美國原版)
暫譯: 3D 集成電路的物理設計 (美國原版)

Todri-Sanial, Aida, Tan, Chuan Seng, Iniewski, Krzysztof

Physical Design for 3D Integrated Circuits (美國原版)

相關主題

商品描述

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

 

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

 

 

 

 

 

 

  • Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
  • Supplies state-of-the-art solutions for challenges unique to 3D circuit design
  • Features contributions from renowned experts in their respective fields

 

Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

商品描述(中文翻譯)

《3D 集成電路的物理設計》揭示了如何有效且最佳地設計 3D 集成電路（IC）。它還分析了 3D 電路的設計工具，同時利用 3D 技術的優勢。

本書首先提供了有關傳統 2D 電路的物理設計挑戰的概述，然後每一章深入探討特定的物理設計主題。這本全面的參考書：

- 包含對 2.5D/3D IC 和單片 3D IC 的物理設計的廣泛覆蓋
- 提供針對 3D 電路設計獨特挑戰的最先進解決方案
- 特別收錄了各自領域知名專家的貢獻

《3D 集成電路的物理設計》為追求 2.5D/3D 技術的人士提供了一個方便的前沿資訊來源。

作者簡介

Aida Todri-Sanial holds a BS in electrical engineering from Bradley University, IL; an MS in electrical engineering from California State University, Long Beach, CA; and a PhD in electrical and computer engineering from the University of California, Santa Barbara. She has held visiting research positions at Cadence Design Systems, Mentor Graphics, IBM TJ Watson Research Center, and STMicroelectronics. She was a recipient of the John Bardeen Fellowship and an R&D engineer at Fermilab, IL. She is currently a research scientist at CNRS, France and a member of the Microelectronics Department at LIRMM, where she is the group leader of Integration and Design of Energy-Aware Circuits and Systems. Widely published, highly decorated, and an IEEE and ACM member, Dr. Todri-Sanial participates in several international conference committees and serves as an associate editor for IEEE TVLSI journal. She is also engaged with the EPWS and WiTEC.

 

Chuan Seng Tan holds a BEng in electrical engineering from the University of Malaya, Malaysia; an MEng in advanced materials from the National University of Singapore; and a PhD in electrical engineering from the Massachusetts Institute of Technology, Cambridge. He has been a research engineer with the Institute of Microelectronics, Singapore; an Applied Materials Graduate Fellow; and an intern at Intel Corporation, Oregon. He is currently an associate professor at Nanyang Technological University, Singapore, where he previously served as a Lee Kuan Yew Postdoctoral Fellow and an inaugural Nanyang Assistant Professor. Widely published, Dr. Tan participates in several international conference committees and is a member of the IEEE. He has edited three and co-authored two books, and serves as an associate editor for Elsevier Microelectronics Journal.

作者簡介(中文翻譯)

Aida Todri-Sanial 擁有伊利諾伊州布拉德利大學的電機工程學士學位、加州州立大學長灘分校的電機工程碩士學位，以及加州大學聖巴巴拉分校的電機與計算機工程博士學位。她曾在Cadence Design Systems、Mentor Graphics、IBM TJ Watson Research Center和STMicroelectronics擔任訪問研究職位。她是John Bardeen Fellowship的獲得者，並曾在伊利諾伊州的Fermilab擔任研發工程師。她目前是法國國家科學研究中心（CNRS）的研究科學家，並且是LIRMM微電子部門的成員，擔任能源感知電路與系統整合與設計小組的組長。Todri-Sanial博士發表了大量論文，獲得多項榮譽，並且是IEEE和ACM的成員，參與多個國際會議委員會，並擔任IEEE TVLSI期刊的副編輯。她也參與EPWS和WiTEC的相關工作。

Chuan Seng Tan 擁有馬來西亞馬來亞大學的電機工程學士學位、新加坡國立大學的先進材料碩士學位，以及麻省理工學院的電機工程博士學位。他曾在新加坡微電子研究所擔任研究工程師，並且是應用材料的研究生獎學金得主，還曾在俄勒岡州的英特爾公司實習。他目前是新加坡南洋理工大學的副教授，之前曾擔任李光耀博士後研究員和首任南洋助理教授。Tan博士發表了大量論文，參與多個國際會議委員會，並且是IEEE的成員。他編輯了三本書籍並共同撰寫了兩本書，並擔任Elsevier微電子期刊的副編輯。

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