Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
暫譯: 高速印刷電路板及封裝的電磁相容性建模與設計

《高頻印刷電路板及封裝的電磁相容性建模與設計》介紹了與高頻印刷電路板（PCB）及電子封裝相關的三個主要電磁相容性（EMC）問題的電磁建模與設計：信號完整性（SI）、電源完整性（PI）和電磁干擾（EMI）。重點放在PCB和封裝的兩個基本被動元件上：電源分配網路和信號分配網路。本書分為兩部分。第一部分討論用於EMC建模的場-電路混合方法，包括模態法、積分方程法、圓柱波展開法和去嵌入法。第二部分說明EMC設計方法，並探討新型超材料和二維材料在傳統EMC問題上的應用。

本書旨在增強實用工程師的電磁理論和數學方法，並培訓學生掌握先進的EMC應用。

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi'an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China's Ministry of Education.

His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.

魏興昌於2001年獲得中國西安電子科技大學電機工程博士學位。從2001年到2010年，他在新加坡A*STAR高效能計算研究所擔任研究員、高級研究工程師，然後是研究科學家。他因為對新型電磁相容性（EMC）測量設施的開發做出的貢獻，於2007年獲得新加坡工程師學會的卓越工程成就獎。2010年，他加入中國杭州的浙江大學，擔任正教授，並獲得中國教育部的新世紀優秀人才獎。

他的主要研究興趣包括高頻印刷電路板的電源完整性和信號完整性模擬與設計、通過中介孔的分析，以及計算電磁學的快速算法開發。他在高頻印刷電路板和封裝的EMC建模與設計方面擁有超過10年的研究經驗。他在這一領域已發表超過50篇論文，發表於IEEE Transactions和IEEE國際會議。