Electronic Assembly Fabrication
暫譯: 電子組裝製造

* Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition

* Non-specialists guide to assembly fabrication--no advance degrees or math background necessary

YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS

Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.

Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into:

* Chips

* Boards

* Solders

* Packages

* Interconnections

* Substrates

* Deposition

* Cleaning

* Coating

* The latest environmental rules and constraints

ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.

Contents

     Preface
     Contributors
     Dedication
    Chapter 1: Printed Circuit History and Overview
    Chapter 2: Development and Fabrication of IC Chips
    Chapter 3: Packaging of IC Chips
    Chapter 4: Laminates and Prepregs as Circuit Board Base Materials
    Chapter 5: Printed Circuit Board Fabrication
    Chapter 6: Package and Component Attachment and Interconnection
    Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication
    Chapter 8: Printed Wiring Board Cleaning
    Chapter 9: Board Coating Materials and Processes
    Chapter 10: Flexible and Rigid Flexible Fabrication
    Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites
    Chapter 12: Hybrid Microelectronics and Multichip Module Technologies
    Chapter 13: Environmental Considerations in Electronic Assembly Fabrication
     Index
     About the Editor