Wire Bonding in Microelectronics, 2/e: Materials, Processes, Reliability, and Yield
暫譯: 微電子中的線焊接技術（第二版）：材料、工藝、可靠性與良率

Description

The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.

 

Table of Contents

Technical Introduction to the Second Edition.
Ultrasonic Bonding Systems and Technologies (Including Ultrasonic Wire Bonding Mechanism).
Some Aspects of Bonding Wire Characteristics That can Affect Bonding, Reliability, or Testing.
Wire Bond Testing.
Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions Encountered in Wire Bonding.
Bond Failures Resulting from Gold-Plating Impurities and Conditions.
Cleaning to Improve Bondability and Reliability.
Mechanical Problems in Wire Bonding.
High-Yield and Fine-Pitch Wire Bonding.
Wire Bonding to Multichip Modules and Other Soft Substrates.
Glossary.
Index.