Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation

Wu, Yongle, Wang, Weimin

  • 出版商: Springer
  • 出版日期: 2024-06-03
  • 售價: $5,760
  • 貴賓價: 9.5$5,472
  • 語言: 英文
  • 頁數: 311
  • 裝訂: Quality Paper - also called trade paper
  • ISBN: 9819914574
  • ISBN-13: 9789819914579
  • 相關分類: 微波工程 Microwave
  • 海外代購書籍(需單獨結帳)

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作者簡介

Prof. Yongle Wu received his Ph.D. degree in electronic engineering from Beijing University of Posts and Telecommunications (BUPT), China, in 2011. He was a Research Assistant at the City University of Hong Kong (CityU) from April to October 2010. Prof Wu is currently a Professor with the School of Integrated Circuits, BUPT. His research interests include integrated circuits, microwave components, antennas, and wireless systems design.
Weimin Wang received the M.S. degree in Electromagnetic Field and Microwave Technology and the Ph. D. degree in Electronic Science and Technology from Beijing University of Posts and Telecommunications (BUPT), in 2004 and 2014 She is currently an Associate Professor in the School of Electronic Engineering, BUPT. Her research interests include electromagnetic field, antennas, microwave circuits and antenna measurement.

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