Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
- 出版商: Springer
- 出版日期: 2024-03-29
- 售價: $5,130
- 貴賓價: 9.5 折 $4,874
- 語言: 英文
- 頁數: 525
- 裝訂: Quality Paper - also called trade paper
- ISBN: 9811999198
- ISBN-13: 9789811999192
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作者簡介
John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow
Unimicron Technology Corporation, John_Lau@unimicron.com
SPECIALIZED PROFESSIONAL COMPETENCIES
[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.
[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.
[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.
Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.
