Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.

Chiplet Design and Heterogeneous Integration Packaging
  • 出版商: Springer
  • 出版日期: 2024-03-29
  • 售價: $4,700
  • 貴賓價: 9.5 折 $4,465
  • 語言: 英文
  • 頁數: 525
  • 裝訂: Quality Paper - also called trade paper
  • ISBN: 9811999198
  • ISBN-13: 9789811999192

    • 海外代購書籍(需單獨結帳)

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作者簡介

For Internal Use Only:

John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow

Unimicron Technology Corporation, John_Lau@unimicron.com

SPECIALIZED PROFESSIONAL COMPETENCIES

[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.

[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.

[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.

Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.

作者簡介(中文翻譯)

僅供內部使用：約翰·劉博士，P.E.，IEEE院士，ASME院士，IMAPS院士。Unimicron Technology Corporation，John_Lau@unimicron.com。

專業能力：
[1] 電子和光電元件及系統的設計、分析、材料、製程、製造、驗證、可靠性測試和熱管理。扇出/扇入WLP、MEMS、LED、CIS、TSV、3D IC整合、異質整合/SiP和SMT。無鉛焊接、製造和焊點可靠性。
[2] 管理研發團隊，開發半導體先進封裝的新技術。
[3] 向高層管理提供先進封裝的最新進展和趨勢，並為年輕工程師和經理提供指導。

著有22本書（全部為第一作者），517篇同行評審的論文（其中375篇為主要調查者），40項已獲得和待批准的美國專利（其中25項為主要發明者），以及325場主題演講/講座。

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