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商品描述
This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.
商品描述(中文翻譯)
本書為讀者提供多種工具，以應對熱載子退化所帶來的挑戰，這是當今半導體設備中最複雜的可靠性問題之一。內容涵蓋了載子在設備內的傳輸解釋，以及它們如何獲取能量（“變熱”）的記錄，冷載子和熱載子與缺陷前驅體的相互作用，最終導致缺陷的產生，並描述這些缺陷如何與設備互動，從而降低其性能。
