Unraveling Bluetooth Low Energy Audio: Stretching the Limits of Interoperable Wireless Audio with Bluetooth Next-Generation Audio Standards
暫譯: 解密藍牙低功耗音頻：擴展藍牙下一代音頻標準的可互操作無線音頻極限

探索藍牙低功耗（LE）如何改變音頻領域，從音樂串流到語音識別應用。本書描述了轉向LE音頻的理由、潛在的節能效果，以及如何將各種規範連結在一起以開發最終產品。

LE音頻是藍牙音頻標準的自然發展。該標準涵蓋了十多個不同的規範，從應用配置文件到主機部分和控制器部分的核心傳輸。您將看到這種新的藍牙音頻堆疊架構如何定義從核心控制器到主機協議和配置文件的LE音頻堆疊。

您還將學習如何擺脫線纜和充電。LE音頻引入了一種新的音頻壓縮編解碼器，稱為LC3（低複雜度通信編解碼器），它涵蓋了高保真度、低複雜度和低比特率的全範圍語音和媒體應用的取樣率，並且非常適合新的應用，例如語音助手和遊戲。

《解密藍牙低功耗音頻》為任何對新LE音頻技術感到好奇的人提供了完整的背景。

您將學到的內容：

- 了解LE音頻相對於當前標準的優勢
- 描述整體藍牙LE音頻堆疊及其各個區塊
- 使用核心控制器規範啟用LE音頻
- 了解端到端應用如何在LE音頻生態系統中運作
- 檢視LE音頻如何應對當前和未來的互操作無線音頻趨勢

本書的目標讀者是開發人員、製造商、學生、講師、教師、科技愛好者、平台整合者和企業家。

Himanshu Bhalla is a Software Architect in the Client Computing Group (CCG) inside Intel Corporation and is based out of Bengaluru, India. He is a Computer Science graduate of IIT-BHU (Indian Institute of Technology - (BHU), Varanasi) and has over 17 years of experience in Software architecture, design and development. He spent most of his career in the Bluetooth and wireless technology domain. During the start of his career he was involved with a startup (Impulsesoft) which was behind one of the world's first Bluetooth combined (HF and A2DP) audio headsets in the market. He later worked with Broadcom where he was the architect for Bluetooth Software on Samsung Tizen DTV and received a key achievement award for it. He also contributed to Wi-Fi Direct Services (WFDS) standard and represented Broadcom in the Wi-Fi Alliance. In Intel, he contributed to Wi-Fi Serial Bus (WSB) standard and was instrumental in developing MAUSB (Media Agnostic USB) Software technology. He was a key contributor to Bluetooth Low Energy Audio standard and was editor of multiple critical specifications (ASCP, BAP, etc.). He received the prestigious "Outstanding New Contributor of the year" award for this work from the Chairman of Board of Directors of Bluetooth SIG during the Working Group Summit in Kirkland in 2018 - this award is based on anonymous voting by the members of the Bluetooth SIG Working Groups. For this, he was featured on the Bluetooth SIG website and also on Bluetooth SIG LinkedIn account, and this was written about him - "The procedures which he defined are a corner stone for LE audio". He was also interviewed inside Intel and his interview was featured in the company's "Inside Blue" portal. He also represents Intel in Bluetooth Architecture Review Board (BARB) and has provided feedback to over 20 specifications spanning across various Bluetooth SIG Working Groups (e.g. Mesh, ATA, GA, etc.). He is also a prolific inventor and has 4 patents granted and 4 more filed with the USPTO. He considers this book as an attempt to give back to the technology and a means to show gratitude to everyone involved in development of this standard.

Oren Haggai is a system architect in the wireless connectivity solutions group at Intel Israel, focusing on Bluetooth technology. He has over 20 years of experience working on various wireless products and standards. Over the years, he contributed to the specification development from early Bluetooth Core 0.7, 0.9, 1.0B, 1.1, 2.1, 4.1 and 5.2, until the latest state of the Bluetooth specifications. He began working on Bluetooth in 1999, while studying at the Technion university, Israel Institute of Technology, where he received a BSc in Computer and Software Engineering from the EE faculty. While at the university he integrated a Bluetooth stack for handheld PCs and phone form factors and instructed students in various Bluetooth projects. He designed and implemented a wireless local information system based on Bluetooth for the EE faculty at the Technion. He later joined a startup (Mobilian) in 2001 which integrated the world's first single chip Wi-Fi/Bluetooth coexistence solution which was the basis of the PTA 3-wire standard. While at Mobilian he designed the world's first wireless desktop system, enabling the concurrent operation of Bluetooth mouse, keyboard, A2DP music, file transfer, while co-running and co-exist with Wi-Fi networks. He joined Intel in 2003, as part of Mobilian's acquisition by Intel. At Intel he designed and developed Bluetooth solutions for phones and PCs, and a quality of service based dynamic connection manager for cellular WiMAX networks. He wrote system requirements for Bluetooth Low energy for Intel products and became a Bluetooth training champion at Intel, providing training to multiple discipline teams from RF, analog, HW, VLSI, firmware software and validation. He designed numerous MAC and PHY modules in Wi-Fi and in Bluetooth, which are driving a few generations of Intel Wi-Fi/Bluetooth wireless solutions in today's Intel based PCs. He is a member in the following Bluetooth SIG working groups: Audio Telephony and Automotive Working Group (ATAWG), Hearing Aids Working Group (HAWG), Generic Audio Working Group (GAWG) and Core Spec Working Group (CSWG). He contributed to every aspect of the LE Audio specifications in Controller, Host and Codec. He initiated the 0.7 version of the LE Audio stream control specifications, while defining the basic stream control quality of service procedures and coined a few popular LE Audio terms such as PAC (Published Audio Capability) and BASE (Broadcast Audio Source Endpoint). He holds several patents in the area of wireless communications. He sees the latest development in the Bluetooth specifications as an exciting era and a renaissance of the Bluetooth technology, and wishes to spread that knowledge to a wider audience.

**Himanshu Bhalla** 是英特爾公司客戶計算集團 (Client Computing Group, CCG) 的軟體架構師，駐於印度班加羅爾。他是印度理工學院瓦拉納西分校 (IIT-BHU) 的計算機科學畢業生，擁有超過 17 年的軟體架構、設計和開發經驗。他的職業生涯大部分時間都專注於藍牙和無線技術領域。在職業生涯的初期，他參與了一家初創公司 (Impulsesoft)，該公司推出了全球首款結合 (HF 和 A2DP) 藍牙音頻耳機之一。之後，他在博通工作，擔任三星 Tizen DTV 的藍牙軟體架構師，並因此獲得了關鍵成就獎。他還為 Wi-Fi Direct Services (WFDS) 標準做出了貢獻，並代表博通參加 Wi-Fi 聯盟。在英特爾，他為 Wi-Fi Serial Bus (WSB) 標準做出了貢獻，並在開發 MAUSB (Media Agnostic USB) 軟體技術方面發揮了重要作用。他是藍牙低功耗音頻標準的主要貢獻者，並擔任多個關鍵規範 (ASCP、BAP 等) 的編輯。他因這項工作於 2018 年在基爾克蘭的工作組峰會上獲得藍牙 SIG 董事會主席頒發的「年度傑出新貢獻者」獎，該獎項是基於藍牙 SIG 工作組成員的匿名投票。為此，他被登載於藍牙 SIG 網站及藍牙 SIG 的 LinkedIn 帳號，並被描述為「他所定義的程序是 LE 音頻的基石」。他還在英特爾內部接受了訪問，該訪問被刊登在公司的「Inside Blue」門戶網站上。他還代表英特爾參加藍牙架構審查委員會 (BARB)，並對超過 20 項跨越各種藍牙 SIG 工作組的規範提供了反饋 (例如 Mesh、ATA、GA 等)。他還是一位多產的發明家，擁有 4 項已授權專利和 4 項正在申請中的專利。他將這本書視為回饋技術的嘗試，以及對所有參與該標準開發的人的感謝之情。

**Oren Haggai** 是英特爾以色列無線連接解決方案組的系統架構師，專注於藍牙技術。他在各種無線產品和標準方面擁有超過 20 年的經驗。多年來，他參與了從早期的藍牙核心 0.7、0.9、1.0B、1.1、2.1、4.1 到 5.2 的規範開發，直到最新的藍牙規範狀態。他於 1999 年開始從事藍牙工作，當時在以色列理工學院 (Technion) 學習，並在電機工程系獲得計算機與軟體工程的學士學位。在大學期間，他為手持電腦和手機形態整合了藍牙堆疊，並指導學生參與各種藍牙專案。他為以色列理工學院的電機工程系設計並實施了一個基於藍牙的無線本地信息系統。2001 年，他加入了一家初創公司 (Mobilian)，該公司整合了全球首個單晶片 Wi-Fi/藍牙共存解決方案，這是 PTA 3 線標準的基礎。在 Mobilian 工作期間，他設計了全球首個無線桌面系統，使藍牙滑鼠、鍵盤、A2DP 音樂、文件傳輸能夠同時運行，並與 Wi-Fi 網絡共存。他於 2003 年加入英特爾，成為 Mobilian 被英特爾收購的一部分。在英特爾，他設計並開發了針對手機和 PC 的藍牙解決方案，以及基於服務質量的動態連接管理器，用於行動 WiMAX 網絡。他為英特爾產品撰寫了藍牙低功耗的系統需求，並成為英特爾的藍牙培訓冠軍，為 RF、類比、硬體、VLSI、韌體軟體和驗證等多個學科團隊提供培訓。他在 Wi-Fi 和藍牙中設計了多個 MAC 和 PHY 模組，這些模組驅動了當今基於英特爾的 PC 中幾代的 Wi-Fi/藍牙無線解決方案。他是以下藍牙 SIG 工作組的成員：音頻電話和汽車工作組 (ATAWG)、助聽器工作組 (HAWG)、通用音頻工作組 (GAWG) 和核心規範工作組 (CSWG)。他對 LE 音頻規範的控制器、主機和編解碼器的每個方面都做出了貢獻。他啟動了 LE 音頻流控制規範的 0.7 版本，定義了基本的流控制服務質量程序，並創造了一些流行的 LE 音頻術語，如 PAC (Published Audio Capability) 和 BASE (Broadcast Audio Source Endpoint)。他在無線通信領域擁有多項專利。他認為藍牙規範的最新發展是一個令人興奮的時代和藍牙技術的文藝復興，並希望將這些知識傳播給更廣泛的受眾。