The Wireless Internet of Things: A Guide to the Lower Layers

Chew, Daniel

The Wireless Internet of Things: A Guide to the Lower Layers

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商品描述

Provides a detailed analysis of the standards and technologies enabling applications for the wireless Internet of Things

The Wireless Internet of Things: A Guide to the Lower Layers presents a practitioner's perspective toward the Internet of Things (IoT) focusing on over-the-air interfaces used by applications such as home automation, sensor networks, smart grid, and healthcare. The author--a noted expert in the field--examines IoT as a protocol-stack detailing the physical layer of the wireless links, as both a radio and a modem, and the media access control (MAC) that enables communication in congested bands. Focusing on low-power wireless personal area networks (WPANs) the text outlines the physical and MAC layer standards used by ZigBee, Bluetooth LE, Z-Wave, and Thread. The text deconstructs these standards and provides background including relevant communication theory, modulation schemes, and access methods.

The author includes a discussion on Wi-Fi and gateways, and explores their role in IoT. He introduces radio topologies used in software-defined radio implementations for the WPANs. The book also discusses channel modelling and link budget analysis for WPANs in IoT. This important text:

  • Introduces IEEE 802.15.4, ITU-T G.9959, and Bluetooth LE as physical layer technology standards enabling wireless IoT
  • Takes a layered approach in order to cultivate an appreciation for the various standards that enable interoperability
  • Provides clarity on wireless standards with particular focus on actual implementation

Written for IoT application and platform developers as well as digital signal processing, network, and wireless communication engineers; The Wireless Internet of Things: A Guide to the Lower Layersoffers an inclusive overview of the complex field of wireless IoT, exploring its beneficial applications that are proliferating in a variety of industries.

作者簡介

DANIEL CHEW is a member of the Senior Professional Staff at The John Hopkins University Applied Physics Laboratory and teaches in the Engineering for Professionals program at The John Hopkins University, USA. He received a Bachelor's degree in Electrical Engineering from the University of Delaware and a Masters in Science in Electrical and Computer Engineering from The Johns Hopkins University. His current research interests include wireless devices and applications.

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