Thermal Management for Opto-Electronics Packaging and Applications
Luo, Xiaobing, Hu, Run, Xie, Bin
- 出版商: Wiley
- 出版日期: 2024-08-12
- 售價: $4,400
- 貴賓價: 9.5 折 $4,180
- 語言: 英文
- 頁數: 368
- 裝訂: Hardcover - also called cloth, retail trade, or trade
- ISBN: 1119179270
- ISBN-13: 9781119179276
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商品描述
A systematic guide to the theory, applications, and design of thermal management for LED packaging
In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design.
The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems.
The book also includes:
- A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials
- Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling
- Practical discussions of thermally enhanced thermal interfacial materials (TIMs)
- Complete treatments of hybrid thermal management in downhole devices
Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
商品描述(中文翻譯)
《光電封裝與應用的熱管理》
一本系統性的LED封裝熱管理理論、應用與設計指南
在《光電封裝與應用的熱管理》一書中，一群傑出的工程師和研究人員提供了LED產品開發所需的基本理論和實用設計的權威討論。讀者將獲得熱管理策略的堅實基礎，並找到有關熱傳遞基本原理、熱模型和熱模擬與設計的最新資訊。
作者解釋了冷卻技術和測試技術，這將幫助讀者評估設備性能並加速設計和製造週期。在這本全面的LED封裝熱管理指南中，書中提供了熱工程設計和光電設備及系統的最新進展。
本書還包括：
- 對熱傳導及其解決方案的徹底介紹，包括熱阻和高熱導材料的討論
- 對熱輻射及其解決方案的全面探討，包括角度和光譜調節的輻射冷卻
- 對熱增強熱界面材料（TIMs）的實用討論
- 對井下設備中混合熱管理的完整處理
《光電封裝與應用的熱管理》非常適合LED封裝和熱傳遞領域的工程師、研究人員和行業專業人士，並將使專注於LED產品設計的高級學生受益。
作者簡介
Xiaobing Luo, PhD, is a Full Professor at School of Energy and Power Engineering, Huazhong University of Science and Technology, China. He is IEEE Fellow and ASME Fellow. He has extensive research experience in thermal management field. He has published more than 200 academic papers and invented novel micro hydraulic suspension pump for liquid cooling system.
Run Hu, PhD, is a Professor and Doctoral Supervisor at the School of Energy and Power Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Outstanding Youth Scholar and Chutian Scholar awards in Hubei province.
Bin Xie, PhD, is an Assistant Professor at the School of Mechanical Science and Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Natural Science Prize of Hubei Province (second class) and the Outstanding Paper Award from the International Conference on Electronic Packaging Technology (ICEPT).
作者簡介(中文翻譯)
Xiaobing Luo, PhD，是中國華中科技大學能源與動力工程學院的正教授。他是IEEE Fellow和ASME Fellow，擁有豐富的熱管理領域研究經驗。他已發表超過200篇學術論文，並發明了新型微型液壓懸吊泵，用於液冷系統。
Run Hu, PhD，是中國華中科技大學能源與動力工程學院的教授及博士生導師。他曾獲得湖北省優秀青年學者和楚天學者獎。
Bin Xie, PhD，是中國華中科技大學機械科學與工程學院的助理教授。他曾獲得湖北省自然科學獎（第二類）和國際電子封裝技術會議（ICEPT）的優秀論文獎。
