Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
暫譯: 電子包裝實務指南：熱與機械設計與分析（第三版）

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.

Additionally, the author:

• Addresses various cross-discipline issues in the design of electromechanical products
• Provides a solid foundation for heat transfer, vibration, and life expectancy calculations
• Identifies reliability issues and concerns
• Develops the ability to conduct a more thorough analysis for the final design
• Includes design tips and guidelines for each aspect of electronics packaging

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, - electrical or quality engineering.