Analysis of Grounding and Bonding Systems
暫譯: 接地與連接系統分析

Learn the theory behind grounding systems and bonding equipotential connections from a worldwide expert. Through mathematical analysis, comprehensive explanations, and detailed figures, Analysis of Grounding and Bonding Systems explains the theory and the reasons behind basic ground-electrodes (i.e., the sphere, the ground rod, and the horizontal ground wire), and more complex grounding systems (i.e., ground-grids), buried in uniform and non-uniform soils.

Through calculations and explanatory diagrams, this comprehensive guide provides code-complying solutions for the safety against electric shock provided by equipotential bonding connections between exposed-conductive-parts, such as equipment enclosures, and metalwork. Details on the calculation of step and touch voltages in different types of system grounding (i.e., TT, TN, and IT) are provided, also with the aid of solved problems.

Readers will learn how to minimize hazardous interactions between grounding systems, cathodically protected pipelines, and heat networks. The analysis of the effectiveness of bonding systems against electric shock in the case of contact with electric vehicles during charge in the event of ground-faults, which is an upcoming issue challenging our safety, is included.